X-Ray Metrology in Semiconductor Manufacturing. Cet article n’est pas disponible.
Langue : anglais
Edité par CRC Pr I Llc, 2006
- Livre relié
- Neuf

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A propos de cet article
1st edition. 296 pages. 9.50x6.25x0.75 inches. In Stock.
N° de réf. du vendeur x-0849339286
- Titre
- X-Ray Metrology in Semiconductor Manufacturing
- Auteur
- Bowen, D. Keith (Author)/ Tanner, Brian K. (Author)
- Éditeur
- CRC Pr I Llc
- Année de publication
- 2006
- État de l'article
- Brand New
- Reliure
- Hardcover
- Langue
- anglais
- ISBN à 10 chiffres
- 0849339286
- ISBN à 13 chiffres
- 9780849339288
- Poids de l'article
- 0,56 kilogramme
The scales involved in modern semiconductor manufacturing and microelectronics continue to plunge downward. Effective and accurate characterization of materials with thicknesses below a few nanometers can be achieved using x-rays. While many books are available on the theory behind x-ray metrology (XRM), X-Ray Metrology in Semiconductor Manufacturing is the first book to focus on the practical aspects of the technology and its application in device fabrication and solving new materials problems.
Following a general overview of the field, the first section of the book is organized by application and outlines the techniques that are best suited to each. The next section delves into the techniques and theory behind the applications, such as specular x-ray reflectivity, diffraction imaging, and defect mapping. Finally, the third section provides technological details of each technique, answering questions commonly encountered in practice. The authors supply real examples from the semiconductor and magnetic recording industries as well as more than 150 clearly drawn figures to illustrate the discussion. They also summarize the principles and key information about each method with inset boxes found throughout the text.
Written by world leaders in the field, X-Ray Metrology in Semiconductor Manufacturing provides real solutions with a focus on accuracy, repeatability, and throughput.
Following a general overview of the field, the first section of the book is organized by application and outlines the techniques that are best suited to each. The next section delves into the techniques and theory behind the applications, such as specular x-ray reflectivity, diffraction imaging, and defect mapping. Finally, the third section provides technological details of each technique, answering questions commonly encountered in practice. The authors supply real examples from the semiconductor and magnetic recording industries as well as more than 150 clearly drawn figures to illustrate the discussion. They also summarize the principles and key information about each method with inset boxes found throughout the text.
Written by world leaders in the field, X-Ray Metrology in Semiconductor Manufacturing provides real solutions with a focus on accuracy, repeatability, and throughput.
« Synopsis » peut appartenir à une autre édition de cet ouvrage.
À propos de l’auteur
D. Keith Bowen, Brian K. Tanner
« A propos de ce titre » peut appartenir à une autre édition de cet ouvrage.
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