Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues, Volume 613 (Materials Research Society MRS Symposium Proceedings)

Editors: Rajiv K. Singh, Rajeev Bajaj, Mansour Moinpour, Marc Meruris

ISBN 10: 1558995218 / ISBN 13: 9781558995215

Edité par Materials Research Socity, 2001

A propos de cet article

EX-LIBRARY book from a company library with typical library stamps, stickers, and markings. Inside pages are all intact. No writing on inside pages of text.

N° de réf. du vendeur 4442

Détails bibliographiques

• Titre: Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues, Volume 613 (Materials Research Society MRS Symposium Proceedings)
• Éditeur: Materials Research Socity
• Date de parution: 2001
• Langue: anglais
• ISBN à 10 chiffres: 1558995218
• ISBN à 13 chiffres: 9781558995215
• Reliure: Hardcover
• Édition: 1st Edition
• État de l'article: Good
• État de la jaquette: No Jacket
• Catalogues du vendeur:
  • Engineering
  • Science

A propos de ce titre

Synopsis

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Présentation de l'éditeur

Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.