Handbook of Thick Film Hybrid Microelectronics : A Practical Sourcebook for Designers, Fabricators and Users

Harper, Charles A. (editor)

ISBN 10: 0070266808 / ISBN 13: 9780070266803

Edité par McGraw-Hill Book Company, New York, 1974

A propos de cet article

New York: McGraw-Hill Book Company, 1974. Near Fine condition. NOT a library discard. A bright, clean, square copy. Sharp corners. NO owner's name or bookplate. Pages are fresh and crisp. NO underlining. NO highlighting. NO margin notes. Hardcover. Each chapter is separately paginated. Photo illustrated. 10 contributors. Glossary. Index. Bound in the original black leatherette (imitation leather), stamped in shiny gold on the spine. First printing with complete number row (1234567890) on the copyright page. . First Printing of the First Edition. Hardcover. Near Fine condition/No jacket. Pages numbered by chapters (but 350 pages?).

N° de réf. du vendeur 015449

Détails bibliographiques

• Titre: Handbook of Thick Film Hybrid Microelectronics : A Practical Sourcebook for Designers, Fabricators and Users
• Éditeur: McGraw-Hill Book Company, New York
• Date de parution: 1974
• Langue: anglais
• ISBN à 10 chiffres: 0070266808
• ISBN à 13 chiffres: 9780070266803
• Reliure: Hardcover
• Édition: First Printing of the First Edition.
• État de l'article: Near Fine condition
• État de la jaquette: No jacket
• Catalogues du vendeur:
  • Science / Technology / Computers

A propos de ce titre

Synopsis

Book by Harper Charles A

À propos de l?auteur

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.