Series: Solid Mechanics and its Applications. Num Pages: 580 pages, biography. BIC Classification: TGMD. Category: (P) Professional & Vocational. Dimension: 240 x 160 x 30. Weight in Grams: 918. . 2010. 1st ed. Softcover of orig. ed. 2006. Paperback. . . . .

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Titre: Mechanics of Microelectronics
�diteur: Springer
Date de parution: 2010
Langue: anglais
ISBN � 10 chiffres: 9048172314
ISBN � 13 chiffres: 9789048172313
Reliure: Couverture souple
�dition: Edition originale
�tat de l'article: New

A propos de ce titre

Synopsis

From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research.

Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Les informations fournies dans la section � A propos du livre � peuvent faire r�f�rence � une autre �dition de ce titre.

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