3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)

ISBN 10: 3319445847 / ISBN 13: 9783319445847

Edité par Springer, 2017

A propos de cet article

Unread book in excellent condition. Language - English. Ships from Berlin. - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

N° de réf. du vendeur ABE-1705620059280

Détails bibliographiques

• Titre: 3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)
• Éditeur: Springer
• Date de parution: 2017
• Langue: anglais
• ISBN à 10 chiffres: 3319445847
• ISBN à 13 chiffres: 9783319445847
• Reliure: Hardcover
• Édition: 1. Auflage
• État de l'article: Sehr gut

A propos de ce titre

Synopsis

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.