Advanced Electronic Packaging - Couverture rigide

Couverture rigide

ISBN 10 : 0471466093 ISBN 13 : 9780471466093

Editeur : Wiley-IEEE Press, 2006

Synopsis

As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.

An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

A propos du livre

À propos de l'auteur

Richard K. Ulrich is a professor of chemical engineering at the University of Arkansas. He is a book editor and columnist on embedded passive technology, a NEMI committee member, an associate editor of IEEE Transactions on Advanced Packaging, and past chairman of chairman of the Dielectric Science and Technology Division of the Electrochemical Society.

WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.

Détails de l'édition

• Éditeur: Wiley-IEEE Press
• Date d'édition: 2006
• Langue: anglais
• ISBN 10: 0471466093
• ISBN 13: 9780471466093
• Reliure: Relié
• Numéro d'édition: 2
• Nombre de pages: 848
• Éditeur: Ulrich Richard K., Brown William D.
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible