Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices - Couverture rigide

Suhir, Ephraim

Couverture rigide

ISBN 10 : 113862473X ISBN 13 : 9781138624733

Editeur : CRC Press, 2021

Synopsis

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

A propos du livre

À propos de l?auteur

Ephraim Suhir is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE); the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE) and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored about 400+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including the 1996 Bell Labs Distinguished Member of Technical Staff Award and the 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering. He is the third Russian American, after Stephen Timoshenko and Igor Sikorsky, who received this prestigious award.

Détails de l'édition

• Éditeur: CRC Press
• Date d'édition: 2021
• Langue: anglais
• ISBN 10: 113862473X
• ISBN 13: 9781138624733
• Reliure: Relié
• Nombre de pages: 382
• Coordonnées du fabricant: non disponible