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Progress in SOI Structures and Devices Operating at Extreme Conditions (Nato Science Series II (closed)) - Couverture souple
Synopsis
A review of the electrical properties, performance and physical mechanisms of the main silicon-on-insulator (SOI) materials and devices. Particular attention is paid to the reliability of SOI structures operating in harsh conditions. The first part of the book deals with material technology and describes the SIMOX and ELTRAN technologies, the smart-cut technique, SiCOI structures and MBE growth. The second part covers reliability of devices operating under extreme conditions, with an examination of low and high temperature operation of deep submicron MOSFETs and novel SOI technologies and circuits, SOI in harsh environments and the properties of the buried oxide. The third part deals with the characterization of advanced SOI materials and devices, covering laser-recrystallized SOI layers, ultrashort SOI MOSFETs and nanostructures, gated diodes and SOI devices produced by a variety of techniques. The last part reviews future prospects for SOI structures, analyzing wafer bonding techniques, applications of oxidized porous silicon, semi-insulating silicon materials, self-organization of silicon dots and wires on SOI and some new physical phenomena.
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Progress In Soi Structures And Devices Operating At Extreme Conditions (nato Science Series Ii: Mathematics, Physics And Chemistry)
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Progress In Soi Structures And Devices Operating At Extreme Conditions (nato Science Series Ii: Mathematics, Physics And Chemistry)
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Progress in SOI Structures and Devices Operating at Extreme Conditions
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Progress in SOI Structures and Devices Operating at Extreme Conditions
Edité par
Springer Netherlands Apr 2002, 2002
ISBN 10 : 1402005768
ISBN 13 : 9781402005763
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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -A review of the electrical properties, performance and physical mechanisms of the main silicon-on-insulator (SOI) materials and devices. Particular attention is paid to the reliability of SOI structures operating in harsh conditions. The first part of the book deals with material technology and describes the SIMOX and ELTRAN technologies, the smart-cut technique, SiCOI structures and MBE growth. The second part covers reliability of devices operating under extreme conditions, with an examination of low and high temperature operation of deep submicron MOSFETs and novel SOI technologies and circuits, SOI in harsh environments and the properties of the buried oxide. The third part deals with the characterization of advanced SOI materials and devices, covering laser-recrystallized SOI layers, ultrashort SOI MOSFETs and nanostructures, gated diodes and SOI devices produced by a variety of techniques. The last part reviews future prospects for SOI structures, analyzing wafer bonding techniques, applications of oxidized porous silicon, semi-insulating silicon materials, self-organization of silicon dots and wires on SOI and some new physical phenomena. 364 pp. Englisch. N° de réf. du vendeur 9781402005763
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Progress in SOI Structures and Devices Operating at Extreme Conditions
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Progress in SOI Structures and Devices Operating at Extreme Conditions
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Progress in SOI Structures and Devices Operating at Extreme Conditions (Nato Science Series II:)
Edité par
Springer, 2002
ISBN 10 : 1402005768
ISBN 13 : 9781402005763
Ancien ou d'occasion
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Progress in SOI Structures and Devices Operating at Extreme Conditions
Edité par
Springer Netherlands, Springer Netherlands Apr 2002, 2002
ISBN 10 : 1402005768
ISBN 13 : 9781402005763
Neuf
Taschenbuch
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -A review of the electrical properties, performance and physical mechanisms of the main silicon-on-insulator (SOI) materials and devices. Particular attention is paid to the reliability of SOI structures operating in harsh conditions. The first part of the book deals with material technology and describes the SIMOX and ELTRAN technologies, the smart-cut technique, SiCOI structures and MBE growth. The second part covers reliability of devices operating under extreme conditions, with an examination of low and high temperature operation of deep submicron MOSFETs and novel SOI technologies and circuits, SOI in harsh environments and the properties of the buried oxide. The third part deals with the characterization of advanced SOI materials and devices, covering laser-recrystallized SOI layers, ultrashort SOI MOSFETs and nanostructures, gated diodes and SOI devices produced by a variety of techniques. The last part reviews future prospects for SOI structures, analyzing wafer bonding techniques, applications of oxidized porous silicon, semi-insulating silicon materials, self-organization of silicon dots and wires on SOI and some new physical phenomena.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 364 pp. Englisch. N° de réf. du vendeur 9781402005763
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Progress in SOI Structures and Devices Operating at Extreme Conditions (NATO Science Series II: Mathematics, Physics and Chemistry, 58)
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
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Progress in SOI Structures and Devices Operating at Extreme Conditions
Edité par
Springer Netherlands, Springer Netherlands, 2002
ISBN 10 : 1402005768
ISBN 13 : 9781402005763
Neuf
Taschenbuch
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - A review of the electrical properties, performance and physical mechanisms of the main silicon-on-insulator (SOI) materials and devices. Particular attention is paid to the reliability of SOI structures operating in harsh conditions. The first part of the book deals with material technology and describes the SIMOX and ELTRAN technologies, the smart-cut technique, SiCOI structures and MBE growth. The second part covers reliability of devices operating under extreme conditions, with an examination of low and high temperature operation of deep submicron MOSFETs and novel SOI technologies and circuits, SOI in harsh environments and the properties of the buried oxide. The third part deals with the characterization of advanced SOI materials and devices, covering laser-recrystallized SOI layers, ultrashort SOI MOSFETs and nanostructures, gated diodes and SOI devices produced by a variety of techniques. The last part reviews future prospects for SOI structures, analyzing wafer bonding techniques, applications of oxidized porous silicon, semi-insulating silicon materials, self-organization of silicon dots and wires on SOI and some new physical phenomena. N° de réf. du vendeur 9781402005763
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