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Description du livre Hardcover. Etat : new. N° de réf. du vendeur 9781441995414
Description du livre Etat : New. N° de réf. du vendeur ABLIING23Mar2411530297704
Description du livre Etat : New. Buy with confidence! Book is in new, never-used condition. N° de réf. du vendeur bk1441995412xvz189zvxnew
Description du livre Etat : New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book. N° de réf. du vendeur ria9781441995414_lsuk
Description du livre Gebunden. Etat : New. N° de réf. du vendeur 4176714
Description du livre Etat : New. New! This book is in the same immaculate condition as when it was published. N° de réf. du vendeur 353-1441995412-new
Description du livre Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous 'manufacturing-ready' GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process. 588 pp. Englisch. N° de réf. du vendeur 9781441995414
Description du livre Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous 'manufacturing-ready' GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process. N° de réf. du vendeur 9781441995414