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Synopsis
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Edité par
Springer New York, 2012
ISBN 10 : 1441995412
ISBN 13 : 9781441995414
Neuf
Couverture rigide
Vendeur : moluna, Greven, Allemagne
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Gebunden. Etat : New. N° de réf. du vendeur 4176714
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
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Etat : New. In English. N° de réf. du vendeur ria9781441995414_new
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Lim:Design for High Performance,Low Pow (eng)
impression à la demandeVendeur : Brook Bookstore On Demand, Napoli, NA, Italie
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Etat : new. Questo è un articolo print on demand. N° de réf. du vendeur 0d68a9f077c4ac4e3270b85273e824d5
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Edité par
Springer New York Nov 2012, 2012
ISBN 10 : 1441995412
ISBN 13 : 9781441995414
Neuf
Couverture rigide
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous 'manufacturing-ready' GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process. 588 pp. Englisch. N° de réf. du vendeur 9781441995414
Quantité disponible : 2 disponible(s)
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Edité par
Springer New York, Springer New York Nov 2012, 2012
ISBN 10 : 1441995412
ISBN 13 : 9781441995414
Neuf
Couverture rigide
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. Neuware -This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous ¿manufacturing-ready¿ GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 588 pp. Englisch. N° de réf. du vendeur 9781441995414
Quantité disponible : 2 disponible(s)
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Edité par
Springer New York, Springer New York, 2012
ISBN 10 : 1441995412
ISBN 13 : 9781441995414
Neuf
Couverture rigide
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous 'manufacturing-ready' GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process. N° de réf. du vendeur 9781441995414
Quantité disponible : 1 disponible(s)
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
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Etat : New. N° de réf. du vendeur ABLIING23Mar2411530297704
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DESIGN FOR HIGH PERFORMANCE, LOW POWER, AND RELIABLE 3D INTEGRATED CIRCUITS (HB 2013)
Vendeur : UK BOOKS STORE, London, LONDO, Royaume-Uni
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Etat : Brand New. Brand New! Fast Delivery US Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 7-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability. N° de réf. du vendeur CBS 9781441995414
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Physical Design Automation for Through-Silicon-Via Based 3d Integrated Circuits
Vendeur : Revaluation Books, Exeter, Royaume-Uni
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Hardcover. Etat : Brand New. 1st edition. 300 pages. 9.25x1.34x6.10 inches. In Stock. N° de réf. du vendeur x-1441995412
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Edité par
Springer, 2012
ISBN 10 : 1441995412
ISBN 13 : 9781441995414
Ancien ou d'occasion
Couverture rigide
Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
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Hardcover. Etat : Like New. Like New. book. N° de réf. du vendeur ERICA77314419954126
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