This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This present work covers in-depth analysis on estimating SSN and its impact for CMOS based devices and systems. At present semiconductor industries are moving towards scaled CMOS devices and reduced supply voltage. SSN together with coupled noise may limit the packing density, and thereby the frequency of operation of packaged systems. Our goal is to provide efficient and yet reliable methodologies and algorithms to estimate the overall noise containment in single chip and multi-chip package assemblies. We hope that the techniques and results described in this book will be useful as guides for design, package, and system engineers and academia working in this area. Through this monograph, we hope that we have shown the necessity of interactions that are essential between chip design, system design and package design engineers to design and manufacture optimal packaged systems. Work reported in this monograph was partially supported by the grant from Semiconductor Research Corporation (SRC Contract No. 92-MP-086).
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
EUR 9,70 expédition depuis Allemagne vers France
Destinations, frais et délaisVendeur : moluna, Greven, Allemagne
Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using. N° de réf. du vendeur 4194592
Quantité disponible : Plus de 20 disponibles
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This present work covers in-depth analysis on estimating SSN and its impact for CMOS based devices and systems. At present semiconductor industries are moving towards scaled CMOS devices and reduced supply voltage. SSN together with coupled noise may limit the packing density, and thereby the frequency of operation of packaged systems. Our goal is to provide efficient and yet reliable methodologies and algorithms to estimate the overall noise containment in single chip and multi-chip package assemblies. We hope that the techniques and results described in this book will be useful as guides for design, package, and system engineers and academia working in this area. Through this monograph, we hope that we have shown the necessity of interactions that are essential between chip design, system design and package design engineers to design and manufacture optimal packaged systems. Work reported in this monograph was partially supported by the grant from Semiconductor Research Corporation (SRC Contract No. 92-MP-086). 232 pp. Englisch. N° de réf. du vendeur 9781461364061
Quantité disponible : 2 disponible(s)
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This present work covers in-depth analysis on estimating SSN and its impact for CMOS based devices and systems. At present semiconductor industries are moving towards scaled CMOS devices and reduced supply voltage. SSN together with coupled noise may limit the packing density, and thereby the frequency of operation of packaged systems. Our goal is to provide efficient and yet reliable methodologies and algorithms to estimate the overall noise containment in single chip and multi-chip package assemblies. We hope that the techniques and results described in this book will be useful as guides for design, package, and system engineers and academia working in this area. Through this monograph, we hope that we have shown the necessity of interactions that are essential between chip design, system design and package design engineers to design and manufacture optimal packaged systems. Work reported in this monograph was partially supported by the grant from Semiconductor Research Corporation (SRC Contract No. 92-MP-086). N° de réf. du vendeur 9781461364061
Quantité disponible : 1 disponible(s)
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
Etat : New. In. N° de réf. du vendeur ria9781461364061_new
Quantité disponible : Plus de 20 disponibles
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This present work covers in-depth analysis on estimating SSN and its impact for CMOS based devices and systems. At present semiconductor industries are moving towards scaled CMOS devices and reduced supply voltage. SSN together with coupled noise may limit the packing density, and thereby the frequency of operation of packaged systems. Our goal is to provide efficient and yet reliable methodologies and algorithms to estimate the overall noise containment in single chip and multi-chip package assemblies. We hope that the techniques and results described in this book will be useful as guides for design, package, and system engineers and academia working in this area. Through this monograph, we hope that we have shown the necessity of interactions that are essential between chip design, system design and package design engineers to design and manufacture optimal packaged systems. Work reported in this monograph was partially supported by the grant from Semiconductor Research Corporation (SRC Contract No. 92-MP-086).Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 232 pp. Englisch. N° de réf. du vendeur 9781461364061
Quantité disponible : 1 disponible(s)
Vendeur : THE SAINT BOOKSTORE, Southport, Royaume-Uni
Paperback / softback. Etat : New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 361. N° de réf. du vendeur C9781461364061
Quantité disponible : Plus de 20 disponibles
Vendeur : Books Puddle, New York, NY, Etats-Unis
Etat : New. pp. 232. N° de réf. du vendeur 26359073534
Quantité disponible : 4 disponible(s)
Vendeur : Majestic Books, Hounslow, Royaume-Uni
Etat : New. Print on Demand pp. 232 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam. N° de réf. du vendeur 353417505
Quantité disponible : 4 disponible(s)
Vendeur : Revaluation Books, Exeter, Royaume-Uni
Paperback. Etat : Brand New. 226 pages. 9.30x6.20x0.60 inches. In Stock. N° de réf. du vendeur x-146136406X
Quantité disponible : 2 disponible(s)
Vendeur : Biblios, Frankfurt am main, HESSE, Allemagne
Etat : New. PRINT ON DEMAND pp. 232. N° de réf. du vendeur 18359073524
Quantité disponible : 4 disponible(s)