Articles liés à 3D Integration for NoC-based SoC Architectures
Synopsis
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
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Présentation de l'éditeur
3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures.
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3D Integration for NoC-based SoC Architectures
Edité par
Springer New York, 2012
ISBN 10 : 1461427487
ISBN 13 : 9781461427483
Neuf
Couverture souple
Vendeur : moluna, Greven, Allemagne
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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-. N° de réf. du vendeur 4197730
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3d Integration for Noc-based Soc Architectures
Vendeur : GreatBookPrices, Columbia, MD, Etats-Unis
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Etat : New. N° de réf. du vendeur 19278229-n
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3D Integration for NoC-based SoC Architectures
Edité par
Springer New York Dez 2012, 2012
ISBN 10 : 1461427487
ISBN 13 : 9781461427483
Neuf
Taschenbuch
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 288 pp. Englisch. N° de réf. du vendeur 9781461427483
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3D Integration for NoC-based SoC Architectures
Edité par
Springer US, Springer New York, 2012
ISBN 10 : 1461427487
ISBN 13 : 9781461427483
Neuf
Taschenbuch
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. N° de réf. du vendeur 9781461427483
Quantité disponible : 1 disponible(s)
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3D Integration for NoC-based SoC Architectures
Edité par
Springer US, Springer New York Dez 2012, 2012
ISBN 10 : 1461427487
ISBN 13 : 9781461427483
Neuf
Taschenbuch
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 288 pp. Englisch. N° de réf. du vendeur 9781461427483
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
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Etat : New. In. N° de réf. du vendeur ria9781461427483_new
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3D Integration for NoC-based SoC Architectures
Vendeur : Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlande
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Etat : New. 2012. Paperback. . . . . . N° de réf. du vendeur V9781461427483
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3d Integration for Noc-based Soc Architectures
Edité par
Springer, 2012
ISBN 10 : 1461427487
ISBN 13 : 9781461427483
Ancien ou d'occasion
Couverture souple
Vendeur : GreatBookPrices, Columbia, MD, Etats-Unis
Évaluation du vendeur 5 sur 5 étoiles
Etat : As New. Unread book in perfect condition. N° de réf. du vendeur 19278229
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
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Etat : New. N° de réf. du vendeur ABLIING23Mar2716030035852
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3D Integration for NoC-based SoC Architectures (Paperback)
Edité par
Springer-Verlag New York Inc., New York, NY, 2012
ISBN 10 : 1461427487
ISBN 13 : 9781461427483
Neuf
Paperback
Vendeur : Grand Eagle Retail, Mason, OH, Etats-Unis
Évaluation du vendeur 5 sur 5 étoiles
Paperback. Etat : new. Paperback. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. N° de réf. du vendeur 9781461427483
Quantité disponible : 1 disponible(s)