Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly - Couverture souple
Synopsis
I-Overview.- 1 Introduction.- 2 Interdisciplinary Approach.- II-Basic Technologies.- 3 Chemical and Physical Characteristics.- 4 Metallurgical Aspects.- 5 Rheology of Solder Pastes.- III-Methodologies and Applications.- 6 Application Techniques.- 7 Soldering Methodologies.- 8 Cleaning.- IV-Reliability, Quality Control, and Tests.- 9 Solder Joint Reliability and Inspection.- 10 Special Topics in Surface Mount Soldering Problems and Other Soldering-Related Problems.- 11 Quality Assurance and Tests.- V-Future Tasks and Emerging Trends.- 12 Future Developments.- VI-Appendix.- I. Federal Specification QQ-S-571E and Amendment 4.- II. Ternary Phase Diagram: Pb-Ag-Sn, Sn-Pb-Bi.- III. Military Specification MIL-P-28809A: Printed Wiring Assemblies.- IV. Quantitative Determination of Rosin Residues on Cleaned Electronics Assemblies.
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