RF and Microwave Microelectronics Packaging - Couverture souple

Couverture souple

ISBN 10 : 1489983244 ISBN 13 : 9781489983244

Editeur : Springer, 2014

Synopsis

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

A propos du livre

Présentation de l'éditeur

This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2014
• Langue: anglais
• ISBN 10: 1489983244
• ISBN 13: 9781489983244
• Reliure: Broché
• Nombre de pages: 304
• Éditeur: Kuang Ken, Kim Franklin, Cahill Sean S.
• Coordonnées du fabricant: non disponible
• Personne responsable: CMN Printpool Inh. Mathis Neumann; https://www.also.com/ec/cms5/en_6000/6000/index.jsp; ; Friedrich-Karl-Str. 9; Hamburg; Allemagne