Design for High Performance, Low Power, and Reliable 3D Integrated Circuits - Couverture souple

Lim, Sung Kyu

 
9781489986962: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Couverture souple
ISBN 10 : 1489986960 ISBN 13 : 9781489986962
Editeur : Springer-Verlag New York Inc., 2014

Synopsis

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Éditeur
Springer-Verlag New York Inc.
Date d'édition
2014
Langue
anglais
ISBN 10 
1489986960
ISBN 13 
9781489986962
Reliure
Broché
Nombre de pages
560
Coordonnées du fabricant
non disponible
Personne responsable
CMN Printpool Inh. Mathis Neumann
https://www.also.com/ec/cms5/en_6000/6000/index.jsp

Friedrich-Karl-Str. 9
Hamburg
Allemagne

Autres éditions populaires du même titre

9781441995414: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Edition présentée

ISBN 10 :  1441995412 ISBN 13 :  9781441995414
Editeur : Springer-Verlag New York Inc., 2012
Couverture rigide