Handbook of Semiconductor Interconnection Technology - Couverture rigide

Couverture rigide

ISBN 10 : 1574446746 ISBN 13 : 9781574446746

Editeur : CRC Press Inc, 2006

Synopsis

First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.

What's in this Edition:

Detailed discussion of electrochemical equipment for plating copper

Information on tools used for evaporation, chemical vapor deposition, and plasma processes

Emphasis on measurement of mechanical and thermal properties of insulators

Methods for characterizing porous dielectric thin films

Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides

Process schemes based on the increased need for borderless contact gates and source/drain

Expanded discussion on choices for low-dielectric insulators

Concentration on electroplated copper, especially morphology of plated films and their properties

Developments in thin film liners and barriers

Expanded material on copper reliability

A propos du livre

À propos de l'auteur

Geraldine C. Schwartz, Geraldine Cogin Shwartz, Kris V. Srikrishnan

Détails de l'édition

• Éditeur: CRC Press Inc
• Date d'édition: 2006
• Langue: anglais
• ISBN 10: 1574446746
• ISBN 13: 9781574446746
• Reliure: Relié
• Numéro d'édition: 2
• Nombre de pages: 520
• Éditeur: Schwartz Geraldine Cogin, Srikrishnan Kris V.
• Coordonnées du fabricant: non disponible
• Personne responsable: non disponible