9781574446746 - handbook of semiconductor interconnection technology (17 résultats)
Handbook of Semiconductor Interconnection Technology, 2nd Edition (Original Price £ 153.00)
Geraldine Cogin Shwartz, Geraldine C. Schwartz, Kris V. Srikrishnan
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- Édition internationale
Vendeur : Basi6 International, Irving, TX, Etats-UnisBasi6 International
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EUR 82,70
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Etat : Brand New. New.SoftCover International edition. Different ISBN and Cover image but contents are same as US edition.Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Handbook of Semiconductor Interconnection Technology
Shwartz, Geraldine Cogin; Schwartz, Geraldine C. [Editor]; Srikrishnan, Kris V. [Editor];
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Vendeur : BennettBooksLtd, Los Angeles, CA, Etats-UnisBennettBooksLtd
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EUR 192,02
EUR 5,98 expéditionExpédition nationale : Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : New. In shrink wrap. Looks like an interesting title.
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Vendeur : PBShop.store UK, Fairford, GLOS, Royaume-UniPBShop.store UK
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EUR 290,22
EUR 7,87 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
HRD. Etat : New. New Book. Shipped from UK. Established seller since 2000.
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Vendeur : GreatBookPrices, Columbia, MD, Etats-UnisGreatBookPrices
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EUR 303,90
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Etat : New.
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Vendeur : GreatBookPricesUK, Woodford Green, Royaume-UniGreatBookPricesUK
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EUR 290,21
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Etat : New.
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Vendeur : GreatBookPrices, Columbia, MD, Etats-UnisGreatBookPrices
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Occasion - Comme neuf
EUR 317,53
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Etat : As New. Unread book in perfect condition.
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Vendeur : GreatBookPricesUK, Woodford Green, Royaume-UniGreatBookPricesUK
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EUR 315,37
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Etat : As New. Unread book in perfect condition.
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Vendeur : Grand Eagle Retail, Bensenville, IL, Etats-UnisGrand Eagle Retail
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EUR 362,89
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Hardcover. Etat : new. Hardcover. First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and ma…ny of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Vendeur : Books Puddle, New York, NY, Etats-UnisBooks Puddle
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EUR 361,54
EUR 3,44 expéditionExpédition nationale : Etats-UnisQuantité disponible : 3 disponible(s)
Etat : New. pp. 536 2nd Edition.
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Vendeur : moluna, Greven, Allemagnemoluna
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EUR 313,20
EUR 48,99 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Etat : New. Geraldine C. Schwartz, Geraldine Cogin Shwartz, Kris V. SrikrishnanFirst introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated .
Handbook of Semiconductor Interconnection Technology, Second Edition
Schwartz, Geraldine C. (Edited by)/ Srikrishnan, Kris V. (Edited by)
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Vendeur : Revaluation Books, Exeter, Royaume-UniRevaluation Books
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EUR 367,97
EUR 17,46 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : Brand New. 2nd edition. 520 pages. 10.00x6.75x1.00 inches. In Stock.
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Vendeur : Biblios, frankfurt am main, HESSE, AllemagneBiblios
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EUR 387,57
EUR 9,95 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 3 disponible(s)
Etat : New. pp. 536.
Handbook of Semiconductor Interconnection Technology
Schwartz, Geraldine Cogin; Srikrishnan, Kris V.; Bross, Arthur. Ed(s): Schwartz, Geraldine Cogin; Srikrishnan, Kris V.
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Vendeur : Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandeKennys Bookshop and Art Galleries Ltd.
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EUR 403,73
EUR 9,50 expéditionExpédition depuis Irlande vers Etats-UnisQuantité disponible : 10 disponible(s)
Etat : New. Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Editor(s): Schwartz,…Geraldine Cogin; Srikrishnan, Kris V. Num Pages: 536 pages, 227 black & white illustrations, 12 black & white tables, 1 black & white halftones. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 30. Weight in Grams: 1133. . 2006. 2 Rev ed. Hardback. . . . .
Handbook of Semiconductor Interconnection Technology, Second Edition
Schwartz, Geraldine C. (Edited by)/ Srikrishnan, Kris V. (Edited by)
- Couverture rigide
Vendeur : Revaluation Books, Exeter, Royaume-UniRevaluation Books
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 455,95
EUR 17,46 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : Brand New. 2nd edition. 520 pages. 10.00x6.75x1.00 inches. In Stock.
Handbook of Semiconductor Interconnection Technology
Schwartz, Geraldine Cogin; Srikrishnan, Kris V.; Bross, Arthur. Ed(s): Schwartz, Geraldine Cogin; Srikrishnan, Kris V.
- Couverture rigide
Vendeur : Kennys Bookstore, Olney, MD, Etats-UnisKennys Bookstore
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 496,67
EUR 9,04 expéditionExpédition nationale : Etats-UnisQuantité disponible : 10 disponible(s)
Etat : New. Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Editor(s): Schwartz,…Geraldine Cogin; Srikrishnan, Kris V. Num Pages: 536 pages, 227 black & white illustrations, 12 black & white tables, 1 black & white halftones. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 30. Weight in Grams: 1133. . 2006. 2 Rev ed. Hardback. . . . . Books ship from the US and Ireland.
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Vendeur : AussieBookSeller, Truganina, VIC, AustralieAussieBookSeller
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 574,85
EUR 31,86 expéditionExpédition depuis Australie vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : new. Hardcover. First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and ma…ny of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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- impression à la demande
Vendeur : Majestic Books, Hounslow, Royaume-UniMajestic Books
Contacter le vendeurVendeur avec une évaluation de 4 étoilesEtat: Neuf
EUR 336,94
EUR 7,56 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 3 disponible(s)
Etat : New. pp. 536 Illus. This item is printed on demand.
