ISBN: 9781574446746 - handbook of semiconductor interconnection technology (18 résultats)

Etat : Brand New. New.SoftCover International edition. Different ISBN and Cover image but contents are same as US edition.Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Hardcover. Etat : New. In shrink wrap. Looks like an interesting title.

HRD. Etat : New. New Book. Shipped from UK. Established seller since 2000.

Etat : New.

Etat : New.

Etat : As New. Unread book in perfect condition.

Etat : As New. Unread book in perfect condition.

Etat : New. pp. 536 2nd Edition.

Etat : New. Geraldine C. Schwartz, Geraldine Cogin Shwartz, Kris V. SrikrishnanFirst introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated .

Hardcover. Etat : new. Hardcover. First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Hardcover. Etat : Brand New. 2nd edition. 520 pages. 10.00x6.75x1.00 inches. In Stock.

Etat : New. pp. 536.

Etat : New. Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Editor(s): Schwartz, Geraldine Cogin; Srikrishnan, Kris V. Num Pages: 536 pages, 227 black & white illustrations, 12 black & white tables, 1 black & white halftones. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 30. Weight in Grams: 1133. . 2006. 2 Rev ed. Hardback. . . . .…

Buch. Etat : Neu. Neuware - First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the 'likely directions' outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition:- Detailed discussion of electrochemical equipment for plating copper - Information on tools used for evaporation, chemical vapor deposition, and plasma processes - Emphasis on measurement of mechanical and thermal properties of insulators - Methods for characterizing porous dielectric thin films - Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides - Process schemes based on the increased need for borderless contact gates and source/drain - Expanded discussion on choices for low-dielectric insulators - Concentration on electroplated copper, especially morphology of plated films and their properties - Developments in thin film liners and barriers - Expanded material on copper reliability.…

Hardcover. Etat : Brand New. 2nd edition. 520 pages. 10.00x6.75x1.00 inches. In Stock.

Etat : New. Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Editor(s): Schwartz, Geraldine Cogin; Srikrishnan, Kris V. Num Pages: 536 pages, 227 black & white illustrations, 12 black & white tables, 1 black & white halftones. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 30. Weight in Grams: 1133. . 2006. 2 Rev ed. Hardback. . . . . Books ship from the US and Ireland.…

Hardcover. Etat : new. Hardcover. First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

Etat : New. pp. 536 Illus. This item is printed on demand.