This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
Ken Kuang is President of Torrey Hills Technologies, LLC, a leader in the supply of quality microelectronics packaging components. From 2004-2013, Kuang led Torrey Hills to rank #188 in INC500 Fast Growing Private Companies in America and rank #2 in San Diego Business Journal 100 Fastest Growing Private Companies in San Diego. Kuang was three times the finalist for the Most Admired CEO in San Diego.
Rick Sturdivant has been President of Microwave Packaging Technology, Inc. (MPT) since 2003. He regularly presents at conference workshops and other venues, and has been a guest lecturer at Georgia Tech Research Institute. He is a recognized expert in the field of Transmit/Receive (T/R) modules for phased array radar and communication systems.
Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.
Vendeur : HPB-Red, Dallas, TX, Etats-Unis
Hardcover. Etat : Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! N° de réf. du vendeur S_332596028
Quantité disponible : 1 disponible(s)
Vendeur : California Books, Miami, FL, Etats-Unis
Etat : New. N° de réf. du vendeur I-9783319516967
Quantité disponible : Plus de 20 disponibles
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
Etat : New. In. N° de réf. du vendeur ria9783319516967_new
Quantité disponible : Plus de 20 disponibles
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 188 pp. Englisch. N° de réf. du vendeur 9783319516967
Quantité disponible : 2 disponible(s)
Vendeur : moluna, Greven, Allemagne
Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysisBridges the gap between low cost commercial and hi-res RF/Microwave packaging technologiesEngages in an in-depth discussion of challenges in . N° de réf. du vendeur 133676047
Quantité disponible : Plus de 20 disponibles
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
Buch. Etat : Neu. Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to ¿RF and Microwave Microelectronics Packaging¿ (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch. N° de réf. du vendeur 9783319516967
Quantité disponible : 2 disponible(s)
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. N° de réf. du vendeur 9783319516967
Quantité disponible : 1 disponible(s)
Vendeur : Revaluation Books, Exeter, Royaume-Uni
Hardcover. Etat : Brand New. 172 pages. 9.25x6.25x0.50 inches. In Stock. N° de réf. du vendeur x-3319516965
Quantité disponible : 2 disponible(s)