Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry - Couverture souple

Tunga, Krishna

 
9783639133271: Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry
Couverture souple
ISBN 10 : 3639133277 ISBN 13 : 9783639133271
Editeur : VDM Verlag, 2009

Synopsis

This work aims to understand the reliability of SnAgCu solder interconnects used in PBGA packages using microstructure evolution, laser moiré interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and ATC conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moiré interferometry was developed to assess the deformation behavior of SnAgCu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months. FEA in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package.

Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.

Présentation de l'éditeur

This work aims to understand the reliability of SnAgCu solder interconnects used in PBGA packages using microstructure evolution, laser moiré interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and ATC conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moiré interferometry was developed to assess the deformation behavior of SnAgCu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months. FEA in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package.

Biographie de l'auteur

Dr. Krishna Tunga obtained his Masters and Doctorate degree from Georgia Institute of Technology and undergraduate degree from Indian Institute of Technology, Madras. His research interests include electronic packaging, lead-free solders, microstructure evolution, laser moire interferometry, digital image correlation and finite-element analysis.

Les informations fournies dans la section « A propos du livre » peuvent faire référence à une autre édition de ce titre.

Éditeur
VDM Verlag
Date d'édition
2009
Langue
anglais
ISBN 10 
3639133277
ISBN 13 
9783639133271
Reliure
Broché
Nombre de pages
188
Coordonnées du fabricant
non disponible
Personne responsable
non disponible