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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales - Couverture souple
Synopsis
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod- els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication (eng)
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Integrated Modeling of Chemical Mechanical Planari
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
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Springer Berlin Heidelberg Dez 2010, 2010
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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an 'integrated model' and, more specifically, we include the important role of the mechanical elements of the process. 336 pp. Englisch. N° de réf. du vendeur 9783642061158
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
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Springer Berlin Heidelberg, 2010
ISBN 10 : 364206115X
ISBN 13 : 9783642061158
Neuf
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication | From Particle Scale to Feature, Die and Wafer Scales
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Taschenbuch. Etat : Neu. Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication | From Particle Scale to Feature, Die and Wafer Scales | Jianfeng Luo (u. a.) | Taschenbuch | xxiv | Englisch | 2010 | Springer | EAN 9783642061158 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. N° de réf. du vendeur 107167182
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
Edité par
Springer Berlin Heidelberg, Springer Dez 2010, 2010
ISBN 10 : 364206115X
ISBN 13 : 9783642061158
Neuf
Taschenbuch
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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an 'integrated model' and, more specifically, we include the important role of the mechanical elements of the process.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 336 pp. Englisch. N° de réf. du vendeur 9783642061158
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication : From Particle Scale to Feature, Die and Wafer Scales
Edité par
Springer Berlin Heidelberg, Springer, 2010
ISBN 10 : 364206115X
ISBN 13 : 9783642061158
Neuf
Taschenbuch
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Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an 'integrated model' and, more specifically, we include the important role of the mechanical elements of the process. N° de réf. du vendeur 9783642061158
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