Multichip Modules with Integrated Sensors: 3 (closed)) - Couverture souple

Couverture souple

ISBN 10 : 9401066310 ISBN 13 : 9789401066310

Editeur : Springer, 2011

Synopsis

Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by the Technical University of Budapest, Budapest, Hungary, on May 18-20, 1995. Additionally, the Hungarian Chapter of ISHM-The Microelectronics Society held a poster session on this topic. This volume presents the majority of papers presented at the ARW and the ISHM-Hungary Session. The integration of sensors with high .performance MCM structures represent the trend for intelligent electronics. The book reviews advances in MCM technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have lead to the enhanced performance of smart electronics. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging.

A propos du livre

Présentation de l'éditeur

Multichip modules (MCMs) with high wiring density, controlled impedance interconnects and thermal management capability are a recent evolution in electronics, addressing the problems associated with manufacturing high-speed, complex devices. The integration of sensors with high-performance MCM structures represents the trend in intelligent electronics. Advances in such MCM technology are reviewed, including ceramic- based MCM-C, thin film MCM-D and organic laminate-based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are described. Applications of MCM to higher level integration, and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have led to performance enhancement in smart electronic devices. As the table of contents shows, the book addresses the development of new materials, the characterization of methods, and the high-level integration of sensors into electronic packaging.

Détails de l'édition

• Éditeur: Springer
• Date d'édition: 2011
• Langue: anglais
• ISBN 10: 9401066310
• ISBN 13: 9789401066310
• Reliure: Broché
• Nombre de pages: 340
• Éditeur: Jones W.K., Harsányi Gábor
• Coordonnées du fabricant: ProductSafety@springernature.com; ProductSafety@springernature.com; ; Poststr. 9; Darmstadt; 64293; Allemagne