9789401066310 - Multichip Modules with Integrated Sensors: 3 (closed)) (15 résultats)

Etat : New.

Etat : New.

Etat : As New. Unread book in perfect condition.

Etat : New. In.

Etat : New.

Etat : New.

Etat : As New. Unread book in perfect condition.

Paperback. Etat : Brand New. reprint edition. 336 pages. 9.50x5.50x0.90 inches. In Stock.

Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by the Technical University of Budapest, Budapest, Hungary, on May 18-20, 1995. Additionally, the Hungarian Chapter of ISHM-The Microelectronics Society held a poster session on this topic. This volume presents the majority of papers presented at the ARW and the ISHM-Hungary Session. The integration of sensors with high .performance MCM structures represent the trend for intelligent electronics. The book reviews advances in MCM technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have lead to the enhanced performance of smart electronics. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging.

Etat : new. Questo è un articolo print on demand.

Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by the Technical University of Budapest, Budapest, Hungary, on May 18-20, 1995. Additionally, the Hungarian Chapter of ISHM-The Microelectronics Society held a poster session on this topic. This volume presents the majority of papers presented at the ARW and the ISHM-Hungary Session. The integration of sensors with high .performance MCM structures represent the trend for intelligent electronics. The book reviews advances in MCM technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have lead to the enhanced performance of smart electronics. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging. 340 pp. Englisch.

Etat : New. Print on Demand.

Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Research Workshop, Budapest, Hungary, May 18-20, 1995 Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with.

Etat : New. PRINT ON DEMAND.

Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by the Technical University of Budapest, Budapest, Hungary, on May 18-20, 1995. Additionally, the Hungarian Chapter of ISHM-The Microelectronics Society held a poster session on this topic. This volume presents the majority of papers presented at the ARW and the ISHM-Hungary Session. The integration of sensors with high .performance MCM structures represent the trend for intelligent electronics. The book reviews advances in MCM technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have lead to the enhanced performance of smart electronics. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 340 pp. Englisch.