Foldable Flex and Thinned Silicon Multichip Packaging Technology

. Ed(s): Balde, John W.

ISBN 10: 0792376765 / ISBN 13: 9780792376767

Edité par Kluwer Academic Publishers, 2003

Presents the methods used to make stacked chip packages in the 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Editor(s): Balde, John W. Series: Emerging Technology in Advanced Packaging. Num Pages: 347 pages, 266 black & white illustrations, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 22. Weight in Grams: 703. . 2003. Hardback. . . . . Books ship from the US and Ireland. N° de réf. du vendeur V9780792376767

Synopsis :

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Détails bibliographiques

Titre : Foldable Flex and Thinned Silicon Multichip ...
Éditeur : Kluwer Academic Publishers
Date d'édition : 2003
Reliure : Couverture rigide
Etat : New