VLSI-SoC: Design for Reliability, Security, and Low Power : 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers

Youngsoo Shin

ISBN 10: 331946096X / ISBN 13: 9783319460963

Edité par Springer International Publishing, 2016

A propos de cet article

Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.

N° de réf. du vendeur 9783319460963

Détails bibliographiques

• Titre: VLSI-SoC: Design for Reliability, Security, and Low Power : 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers
• Éditeur: Springer International Publishing
• Date de parution: 2016
• Langue: anglais
• ISBN à 10 chiffres: 331946096X
• ISBN à 13 chiffres: 9783319460963
• Reliure: Buch
• État de l'article: Neu

A propos de ce titre

Synopsis

This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.