Solder Joint Reliability: Theory and Applications

Lau, John H.

ISBN 10: 0442002602 / ISBN 13: 9780442002602

Edité par Springer, 1991

A propos de cet article

This book has been read, but is in a clean and very good condition. All pages are intact with no highlighting or writing contained within. The spine remains undamaged with tight binding. Fast dispatch within and from the UK. 100% money back guarantee.

N° de réf. du vendeur ABE-1677440319246

Détails bibliographiques

• Titre: Solder Joint Reliability: Theory and Applications
• Éditeur: Springer
• Date de parution: 1991
• Langue: anglais
• ISBN à 10 chiffres: 0442002602
• ISBN à 13 chiffres: 9780442002602
• Reliure: Hardcover
• Édition: 1st Edition
• État de l'article: Very Good

A propos de ce titre

Synopsis

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me- chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica- tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo- metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.