Halama stefan (12 résultats)

Langue : anglais
Edité par Springer, 2012
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Vendeur : Ria Christie Collections, Uxbridge, Royaume-UniRia Christie Collections
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EUR 60,95
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Etat : New. In.

Langue : anglais
Edité par Springer, 2012
- Couverture souple
Vendeur : Books Puddle, New York, NY, Etats-UnisBooks Puddle
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EUR 78,41
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Etat : New. pp. 324.

Langue : anglais
Edité par Springer Vienna, 2013
- Couverture souple
Vendeur : Revaluation Books, Exeter, Royaume-UniRevaluation Books
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 79,25
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Paperback. Etat : Brand New. 324 pages. 9.61x6.69x0.68 inches. In Stock.

Langue : anglais
Edité par Springer Vienna, 2012
- Couverture souple
Vendeur : moluna, Greven, Allemagnemoluna
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EUR 48,37
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Etat : New.
Autres imagesLangue : anglais
Edité par Springer, 2012
- Couverture souple
Vendeur : preigu, Osnabrück, Allemagnepreigu
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 50,40
EUR 70,00 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 5 disponible(s)
Taschenbuch. Etat : Neu. Technology CAD Systems | Franz Fasching (u. a.) | Taschenbuch | viii | Englisch | 2012 | Springer | EAN 9783709193174 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Langue : anglais
Edité par Springer, 2012
- Couverture souple
Vendeur : AHA-BUCH GmbH, Einbeck, AllemagneAHA-BUCH GmbH
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 59,97
EUR 62,81 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's busines…s. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.

Langue : anglais
Edité par Springer, 2012
- Couverture souple
Vendeur : Mispah books, Redhill, SURRE, Royaume-UniMispah books
Contacter le vendeurVendeur avec une évaluation de 4 étoilesEtat: Occasion - Comme neuf
EUR 111,59
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Paperback. Etat : Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Langue : anglais
Edité par Springer, 2012
- Couverture souple
- impression à la demande
Vendeur : Brook Bookstore On Demand, Napoli, NA, ItalieBrook Bookstore On Demand
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EUR 46,22
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Etat : new. Questo è un articolo print on demand.

Langue : anglais
Edité par Springer Vienna Jan 2012, 2012
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- impression à la demande
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AllemagneBuchWeltWeit Ludwig Meier e.K.
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EUR 53,49
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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in… today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools. 324 pp. Englisch.

Langue : anglais
Edité par Springer, 2012
- Couverture souple
- impression à la demande
Vendeur : Majestic Books, Hounslow, Royaume-UniMajestic Books
Contacter le vendeurVendeur avec une évaluation de 4 étoilesEtat: Neuf
EUR 77,46
EUR 7,57 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 4 disponible(s)
Etat : New. Print on Demand pp. 324 199 Figures, 67:B&W 6.69 x 9.61 in or 244 x 170 mm (Pinched Crown) Perfect Bound on White w/Gloss Lam.

Langue : anglais
Edité par Springer, 2012
- Couverture souple
- impression à la demande
Vendeur : Biblios, frankfurt am main, HESSE, AllemagneBiblios
Contacter le vendeurVendeur avec une évaluation de 4 étoilesEtat: Neuf
EUR 79,98
EUR 9,95 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 4 disponible(s)
Etat : New. PRINT ON DEMAND pp. 324.

Langue : anglais
Edité par Springer Vienna, Springer Jan 2012, 2012
- Couverture souple
- impression à la demande
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagnebuchversandmimpf2000
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 53,49
EUR 60,00 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in tod…ay's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 324 pp. Englisch.