Henshall gregory (17 résultats)
- Couverture rigide
Vendeur : HPB-Red, Dallas, TX, Etats-UnisHPB-Red
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Occasion - Satisfaisant
EUR 89,75
EUR 3,25 expéditionExpédition nationale : Etats-UnisQuantité disponible : 1 disponible(s)
hardcover. Etat : Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
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Vendeur : GreatBookPrices, Columbia, MD, Etats-UnisGreatBookPrices
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 103,50
EUR 2,29 expéditionExpédition nationale : Etats-UnisQuantité disponible : 8 disponible(s)
Etat : New.
- Couverture rigide
Vendeur : INDOO, Avenel, NJ, Etats-UnisINDOO
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EUR 105,87
Frais de port gratuitsExpédition nationale : Etats-UnisQuantité disponible : Plus de 20 disponibles
Etat : New.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
- Couverture rigide
Vendeur : GreatBookPrices, Columbia, MD, Etats-UnisGreatBookPrices
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Occasion - Comme neuf
EUR 120,30
EUR 2,29 expéditionExpédition nationale : Etats-UnisQuantité disponible : 8 disponible(s)
Etat : As New. Unread book in perfect condition.
- Couverture rigide
- Édition originale
Vendeur : Grand Eagle Retail, Bensenville, IL, Etats-UnisGrand Eagle Retail
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 131,71
Frais de port gratuitsExpédition nationale : Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic prope…rties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
- Couverture rigide
Vendeur : PBShop.store UK, Fairford, GLOS, Royaume-UniPBShop.store UK
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 127,66
EUR 5,87 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 2 disponible(s)
HRD. Etat : New. New Book. Shipped from UK. Established seller since 2000.
- Couverture rigide
Vendeur : Rarewaves.com USA, London, LONDO, Royaume-UniRarewaves.com USA
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 141,06
Frais de port gratuitsExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardback. Etat : New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of loc…al microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
- Couverture rigide
Vendeur : GreatBookPricesUK, Woodford Green, Royaume-UniGreatBookPricesUK
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Occasion - Comme neuf
EUR 123,67
EUR 17,54 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 2 disponible(s)
Etat : As New. Unread book in perfect condition.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
- Couverture rigide
Vendeur : GreatBookPricesUK, Woodford Green, Royaume-UniGreatBookPricesUK
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 127,65
EUR 17,54 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 2 disponible(s)
Etat : New.
- Couverture rigide
Vendeur : THE SAINT BOOKSTORE, Southport, Royaume-UniTHE SAINT BOOKSTORE
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 132,96
EUR 19,68 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 2 disponible(s)
Hardback. Etat : New. New copy - Usually dispatched within 4 working days.
- Couverture rigide
Vendeur : Chiron Media, Wallingford, Royaume-UniChiron Media
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 134,45
EUR 18,12 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 2 disponible(s)
Hardcover. Etat : New.
- Couverture rigide
- Édition originale
Vendeur : Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandeKennys Bookshop and Art Galleries Ltd.
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 142,61
EUR 9,50 expéditionExpédition depuis Irlande vers Etats-UnisQuantité disponible : 15 disponible(s)
Etat : New. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas…on reliability. Num Pages: 284 pages, Illustrations. BIC Classification: THX; TJF. Category: (P) Professional & Vocational. Dimension: 213 x 161 x 22. Weight in Grams: 580. . 2011. 1st Edition. Hardcover. . . . .
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Vendeur : Ubiquity Trade, Miami, FL, Etats-UnisUbiquity Trade
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 154,62
EUR 2,60 expéditionExpédition nationale : Etats-UnisQuantité disponible : Plus de 20 disponibles
Etat : New. Brand new! Please provide a physical shipping address.
- Couverture rigide
Vendeur : Kennys Bookstore, Olney, MD, Etats-UnisKennys Bookstore
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 175,23
EUR 9,10 expéditionExpédition nationale : Etats-UnisQuantité disponible : 15 disponible(s)
Etat : New. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas…on reliability. Num Pages: 284 pages, Illustrations. BIC Classification: THX; TJF. Category: (P) Professional & Vocational. Dimension: 213 x 161 x 22. Weight in Grams: 580. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.
- Couverture rigide
- Édition originale
Vendeur : CitiRetail, Stevenage, Royaume-UniCitiRetail
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 145,15
EUR 43,28 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic prope…rties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
- Couverture rigide
Vendeur : Rarewaves.com UK, London, Royaume-UniRarewaves.com UK
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 132,38
EUR 76,02 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardback. Etat : New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of loc…al microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
- Couverture rigide
- Édition originale
Vendeur : AussieBookSeller, Truganina, VIC, AustralieAussieBookSeller
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 208,62
EUR 32,08 expéditionExpédition depuis Australie vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic prope…rties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
