Pak jun (85 résultats)

Hardcover. Etat : Very Good. Binding firm, cover rubbed, interior clean and unmarked.

Hardcover. Etat : Very Good+. Etat de la jaquette : Very Good+. American First. Minor edge wear; otherwise a solid, clean copy with no marking or underlining; dust jacket is protected by a Brodart sleeve. Book.

Etat : As New. Unread book in perfect condition.

Hardcover. Etat : NF. Hardback in Near Fine condition with Near Fine dust jacket. . 4to 11" - 13" tall. 511 pages. * Quick Shipping * All Books Mailed in Boxes * Free Tracking Provided *.

Etat : New.

Etat : New.

Etat : New.

Etat : As New. Unread book in perfect condition.

Etat : New. 1st edition NO-PA16APR2015-KAP.

Etat : New. In English.

Etat : New.

Etat : New.

Etat : Very Good. : Este libro aborda el diseño eléctrico de Through Silicon Via (TSV), un componente esencial en la integración 3D de circuitos electrónicos. Explora las características y desafíos del diseño, ofreciendo información valiosa para ingenieros y estudiantes en el campo de la ingeniería electrónica y el diseño de circuitos. EAN: 9789401790376 Tipo: Libros Categoría: Tecnología Título: Electrical Design of Through Silicon Via Autor: Manho Lee| Jun So Pak| Joungho Kim Idioma: eng Páginas: 280 Formato: Tapa dura Año de publicación: 2014.…

Paperback. Etat : Brand New. 256 pages. 9.21x6.14x0.55 inches. In Stock.

Etat : New. Editor(s): Xing, Jun; Ng, Pak-Sheung; Cheng, Chloe. Num Pages: 256 pages, 11 black & white illustrations, 12 black & white tables. BIC Classification: 1FPCH; 1FPCW; JNAM; JNF; JNM. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156. . . 2018. 1st Edition. paperback. . . . . Books ship from the US and Ireland. …

Etat : New. In English.

Etat : New. In English.

Etat : New. Jun Xing is Professor and Director of the General Education Centre at Hong Kong Polytechnic University. He received his PhD in American Studies from the University of Minnesota at Twin Cities. Trained as a cultural historian, Professor Xing specializes i.

Paperback. Etat : New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Etat : New.

Etat : New. pp. 292.

Etat : New. Editor(s): Xing, Jun; Ng, Pak-Sheung; Cheng, Chloe. Num Pages: 256 pages, 11 black & white illustrations, 12 black & white tables. BIC Classification: 1FPCH; 1FPCW; JNAM; JNF; JNM. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156. . . 2018. 1st Edition. paperback. . . . . …

Etat : New.

Hardcover. Etat : Brand New. 2014 edition. 390 pages. 9.50x6.50x1.00 inches. In Stock.

Etat : New. pp. 250.

Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.…

Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - The book explores the growing tension between indigenous education, the teaching and learning of native knowledge, cultural heritage and traditions and the dynamics of globalization from the Asian perspective. It brings together a distinguished and multidisciplinary group of Asian scholars and practitioners from Nepal, Korea, India, Japan, Thailand, Indonesia, the Philippines, Hong Kong, Taiwan, mainland China, and the United States. After showcasing six in-depth case studies of local cultural traditions from East, South and Southeast Asia, the book examines a variety of pedagogical strategies in the teaching and learning of indigenous knowledge and culture in the region, reflecting both international trends and the distinctive local and regional characteristics resulting from the tremendous diversity within Asian societies.…

Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.…

Taschenbuch. Etat : Neu. Neuware - General Education has taken center stage in the greater China area (Hong Kong, Taiwan and mainland China) because of a number of important developments. First, globalization has created both opportunities and challenges for college students. When they graduate and enter the real world, they must have the cultural sensitivities and social skills, in addition to their professional training, to compete in a knowledge-based global economy. Equally significant for institutions of higher education, pressing global problems challenge traditional disciplines and demand new forms of learning that reshapes the boundaries of knowledge. In response to those rapidly changing dynamics, general education has taken an increasingly important role in undergraduate education.As the first English publication on the subject, this anthology brings together a distinguished group of General Education scholars and teachers from Hong Kong, Taiwan and mainland China.…

Etat : New.