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Vendeur : Romtrade Corp., STERLING HEIGHTS, MI, Etats-Unis
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Ajouter au panierEtat : Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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EUR 42,52
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EUR 43,62
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Vendeur : ALLBOOKS1, Direk, SA, Australie
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Ajouter au panierBrand new book. Fast ship. Please provide full street address as we are not able to ship toPOboxaddress.
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Ajouter au panierEtat : Brand New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 7-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
Edité par Springer
ISBN 10 : 8120090004 ISBN 13 : 9788120090002
Vendeur : Books in my Basket, New Delhi, Inde
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Ajouter au panierHardcover. Etat : New. ISBN: 9783211728604.
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EUR 83,36
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EUR 94,39
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EUR 113,39
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EUR 118,40
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Vendeur : Buchpark, Trebbin, Allemagne
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Ajouter au panierEtat : Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
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Ajouter au panierEtat : Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
Vendeur : Best Price, Torrance, CA, Etats-Unis
EUR 147,06
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Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
EUR 155,88
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Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
EUR 156,13
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Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
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Vendeur : California Books, Miami, FL, Etats-Unis
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Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
EUR 165,27
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Vendeur : Books Puddle, New York, NY, Etats-Unis
EUR 185,48
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Ajouter au panierEtat : New. pp. 480.
Edité par Springer Vienna, Springer Vienna Sep 2007, 2007
ISBN 10 : 3211728600 ISBN 13 : 9783211728604
Langue: anglais
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
EUR 160,49
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Ajouter au panierBuch. Etat : Neu. Neuware -The 'Twelfth International Conference on Simulation of Semiconductor Processes and Devices' (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites. 480 pp. Englisch.
Edité par Springer Vienna, Springer Vienna Apr 2017, 2017
ISBN 10 : 3709119111 ISBN 13 : 9783709119112
Langue: anglais
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
EUR 160,49
Autre deviseQuantité disponible : 2 disponible(s)
Ajouter au panierTaschenbuch. Etat : Neu. Neuware -The 'Twelfth International Conference on Simulation of Semiconductor Processes and Devices' (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 480 pp. Englisch.