ISBN: 9780444425607 - micromachining and micropackaging of transducers (2 résultats)
Micromachining and Micropackaging of Transducers (STUDIES IN ELECTRICAL AND ELECTRONIC ENGINEERING)
Fung, C. D.; Cheung, Peter W.; Ko, Wen H.; Fleming, David G.
- Couverture rigide
Vendeur : -OnTimeBooks-, Phoenix, AZ, Etats-Unis-OnTimeBooks-
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Occasion - Satisfaisant
EUR 40,21
Frais de port gratuitsExpédition nationale : Etats-UnisQuantité disponible : 1 disponible
Etat : good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.…
Micromachining and Micropackaging of Transducers (Studies in Electrical and Electronic Engineering)
C. D. Fung And Peter W. Cheung And Wen H. Ko And David G. Fleming
- Couverture rigide
Vendeur : David's Books, ypsilanti, MI, Etats-UnisDavid's Books
Contacter le vendeurVendeur avec une évaluation de 2 étoilesEtat: Occasion - Moyen
EUR 36,35
EUR 4,78 expéditionExpédition nationale : Etats-UnisQuantité disponible : 1 disponible
Hardcover. Etat : Fair. Etat de la jaquette : No Dust Jacket As Issued. Library pocket and spine tape, cover nicked top of spine ; Ex-Library.
