3d vsp multiwave data processing par liu ming (1 résultats)
- Couverture souple
Vendeur : liu xing, Nanjing, JS, Chineliu xing
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 97,43
EUR 16,18 expéditionExpédition depuis Chine vers Etats-UnisQuantité disponible : 1 disponible
paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2025-01 Pages: 164 Publisher: Northeastern University Press Three-dimensional vertical seismic profiling (3D-VSP) multi-wave data processing is a systematic engineering project. This book details 3D-VSP exploration technology and studies its application in conjunction with rock and rock property parameter variations. It combines seismic profile and well logging data for wavelet extraction. seismic record synthesis. profile compression. stratigraphic compa.…
