Core components development application par sun jian (1 résultats)
- Couverture souple
Vendeur : liu xing, Nanjing, JS, Chineliu xing
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 102,00
EUR 15,70 expéditionExpédition depuis Chine vers Etats-UnisQuantité disponible : 1 disponible(s)
paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2024-12 Publisher: Southeast University This book uses the current bottleneck situation in the chip industry and Moore's Law as a starting point. From the perspective of the upstream and downstream of the integrated circuit supply chain. it analyzes and interprets the…development and shortcomings of the chip industry by focusing on several key figures and milestones in the global semiconductor industry and technological development. The book consists of f.
