Edité par New York, NY, Imprint: Springer., 2014
ISBN 10 : 1461442745 ISBN 13 : 9781461442745
Langue: anglais
Vendeur : Universitätsbuchhandlung Herta Hold GmbH, Berlin, Allemagne
EUR 14
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Ajouter au panierXI, 265 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped.
Edité par Springer-Verlag Publishing, 2013
ISBN 10 : 1461442737 ISBN 13 : 9781461442738
Langue: anglais
Vendeur : Salish Sea Books, Bellingham, WA, Etats-Unis
EUR 101,49
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Ajouter au panierEtat : Like New. Fine/As New; Semi-Flexible Covers; This book is brand new and still sealed in the publisher's original shrinkwrap; Perfect, new condition; This book will be stored and delivered in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Red and purple covers with title in white lettering; 2013, Springer-Verlag Publishing; 265 pages; "Designing 2D and 3D Network-on-Chip Architectures," by Konstantinos Tatas, et al.
Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
EUR 102,80
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Ajouter au panierEtat : New.
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
EUR 99,35
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Ajouter au panierEtat : New. In.
Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
EUR 111,93
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Ajouter au panierEtat : New.
EUR 99,32
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Ajouter au panierPaperback. Etat : New.
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
EUR 111,13
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Ajouter au panierEtat : New. In.
EUR 89,99
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Ajouter au panierEtat : New.
EUR 143,55
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Ajouter au panierEtat : New. pp. 278 Softcover reprint of the original 1st ed. 2014 edition NO-PA16APR2015-KAP.
EUR 100,39
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Ajouter au panierEtat : New.
EUR 154,56
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Ajouter au panierHardcover. Etat : Brand New. 300 pages. 9.25x6.25x0.75 inches. In Stock.
Edité par Springer New York, Springer New York Okt 2013, 2013
ISBN 10 : 1461442737 ISBN 13 : 9781461442738
Langue: anglais
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
EUR 106,99
Quantité disponible : 2 disponible(s)
Ajouter au panierBuch. Etat : Neu. Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 280 pp. Englisch.
EUR 166,59
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Ajouter au panierPaperback. Etat : Brand New. reprint edition. 278 pages. 9.25x6.10x0.66 inches. In Stock.
Edité par Springer New York, Springer New York, 2013
ISBN 10 : 1461442737 ISBN 13 : 9781461442738
Langue: anglais
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
EUR 111,53
Quantité disponible : 1 disponible(s)
Ajouter au panierBuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliabilty. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
Edité par Springer New York, Springer New York Aug 2016, 2016
ISBN 10 : 1493945505 ISBN 13 : 9781493945504
Langue: anglais
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
EUR 119,99
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Ajouter au panierTaschenbuch. Etat : Neu. Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 280 pp. Englisch.
Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
EUR 161,45
Quantité disponible : 1 disponible(s)
Ajouter au panierHardcover. Etat : Like New. Like New. book.
EUR 122,82
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Ajouter au panierTaschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
EUR 193,27
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Ajouter au panierPaperback. Etat : Like New. Like New. book.
Vendeur : Brook Bookstore On Demand, Napoli, NA, Italie
EUR 86,24
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Ajouter au panierEtat : new. Questo è un articolo print on demand.
Edité par Springer New York Okt 2013, 2013
ISBN 10 : 1461442737 ISBN 13 : 9781461442738
Langue: anglais
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
EUR 106,99
Quantité disponible : 2 disponible(s)
Ajouter au panierBuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliabilty. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. 280 pp. Englisch.
Edité par Springer-Verlag New York Inc., 2016
ISBN 10 : 1493945505 ISBN 13 : 9781493945504
Langue: anglais
Vendeur : THE SAINT BOOKSTORE, Southport, Royaume-Uni
EUR 118,24
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Ajouter au panierPaperback / softback. Etat : New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 433.
Edité par Springer New York Aug 2016, 2016
ISBN 10 : 1493945505 ISBN 13 : 9781493945504
Langue: anglais
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
EUR 119,99
Quantité disponible : 2 disponible(s)
Ajouter au panierTaschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. 280 pp. Englisch.
Edité par Springer-Verlag New York Inc., 2013
ISBN 10 : 1461442737 ISBN 13 : 9781461442738
Langue: anglais
Vendeur : THE SAINT BOOKSTORE, Southport, Royaume-Uni
EUR 135,14
Quantité disponible : Plus de 20 disponibles
Ajouter au panierHardback. Etat : New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 575.
Vendeur : Majestic Books, Hounslow, Royaume-Uni
EUR 152,79
Quantité disponible : 4 disponible(s)
Ajouter au panierEtat : New. Print on Demand pp. 278.
Vendeur : preigu, Osnabrück, Allemagne
EUR 94,05
Quantité disponible : 5 disponible(s)
Ajouter au panierBuch. Etat : Neu. Designing 2D and 3D Network-on-Chip Architectures | Konstantinos Tatas (u. a.) | Buch | xiii | Englisch | 2013 | Springer US | EAN 9781461442738 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Vendeur : Biblios, Frankfurt am main, HESSE, Allemagne
EUR 154,58
Quantité disponible : 4 disponible(s)
Ajouter au panierEtat : New. PRINT ON DEMAND pp. 278.