Flexible electronic packaging encapsulation (18 résultats)
- Couverture rigide
Vendeur : PBShop.store UK, Fairford, GLOS, Royaume-UniPBShop.store UK
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 121,41
EUR 6,81 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 2 disponible(s)
HRD. Etat : New. New Book. Shipped from UK. Established seller since 2000.
- Couverture rigide
Vendeur : Chiron Media, Wallingford, Royaume-UniChiron Media
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 123,32
EUR 17,98 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 2 disponible(s)
hardcover. Etat : New.
- Couverture rigide
Vendeur : Ria Christie Collections, Uxbridge, Royaume-UniRia Christie Collections
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 130,01
EUR 13,91 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : Plus de 20 disponibles
Etat : New. In.
- Couverture rigide
Vendeur : Grand Eagle Retail, Bensenville, IL, Etats-UnisGrand Eagle Retail
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 150,74
Frais de port gratuitsExpédition nationale : Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : new. Hardcover. Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress o…n electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposesGuidelines for designing high-performance packaging materials with novel structuresAn authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
- Couverture rigide
Vendeur : Chiron Media, Wallingford, Royaume-UniChiron Media
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 134,30
EUR 17,98 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 3 disponible(s)
hardcover. Etat : New.
- Couverture rigide
Vendeur : Rarewaves USA, OSWEGO, IL, Etats-UnisRarewaves USA
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 157,77
Frais de port gratuitsExpédition nationale : Etats-UnisQuantité disponible : 1 disponible(s)
Hardback. Etat : New. Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic… components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposesGuidelines for designing high-performance packaging materials with novel structuresAn authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
- Couverture rigide
- Édition originale
Vendeur : Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandeKennys Bookshop and Art Galleries Ltd.
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 143,03
EUR 10,50 expéditionExpédition depuis Irlande vers Etats-UnisQuantité disponible : 2 disponible(s)
Etat : New. 2024. 1st Edition. hardcover. . . . . .
- Couverture rigide
Vendeur : Rarewaves.com USA, London, LONDO, Royaume-UniRarewaves.com USA
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 169,68
Frais de port gratuitsExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardback. Etat : New. Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic… components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposesGuidelines for designing high-performance packaging materials with novel structuresAn authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
- Couverture rigide
Vendeur : Rheinberg-Buch Andreas Meier eK, Bergisch Gladbach, AllemagneRheinberg-Buch Andreas Meier eK
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 155,00
EUR 23,00 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Buch. Etat : Neu. Neuware -Systematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology. Englisch.
- Couverture rigide
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AllemagneBuchWeltWeit Ludwig Meier e.K.
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 155,00
EUR 23,00 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Buch. Etat : Neu. Neuware -Systematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology. Englisch.
- Couverture rigide
Vendeur : Kennys Bookstore, Olney, MD, Etats-UnisKennys Bookstore
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 181,08
EUR 9,20 expéditionExpédition nationale : Etats-UnisQuantité disponible : 2 disponible(s)
Etat : New. 2024. 1st Edition. hardcover. . . . . . Books ship from the US and Ireland.
- Couverture rigide
Vendeur : moluna, Greven, Allemagnemoluna
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 136,57
EUR 48,99 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Etat : New. Prof. Hong Meng received his Ph.D. from University of California Los Angeles (UCLA) in 2002. He has been working in the field of organic electronics for more than 30 years. His career experiences including working at the Institute of Materials Science and E.
- Couverture rigide
Vendeur : AussieBookSeller, Truganina, VIC, AustralieAussieBookSeller
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 157,32
EUR 32,42 expéditionExpédition depuis Australie vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : new. Hardcover. Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress o…n electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposesGuidelines for designing high-performance packaging materials with novel structuresAn authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
- Couverture rigide
Vendeur : Rarewaves USA United, OSWEGO, IL, Etats-UnisRarewaves USA United
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 160,23
EUR 43,81 expéditionExpédition nationale : Etats-UnisQuantité disponible : 1 disponible(s)
Hardback. Etat : New. Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic… components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposesGuidelines for designing high-performance packaging materials with novel structuresAn authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
- Couverture rigide
Vendeur : preigu, Osnabrück, Allemagnepreigu
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 132,05
EUR 70,00 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Buch. Etat : Neu. Flexible Electronic Packaging and Encapsulation Technology | Hong Meng (u. a.) | Buch | 384 S. | Englisch | 2024 | Wiley-VCH | EAN 9783527353590 | Verantwortliche Person für die EU: Wiley-VCH GmbH, Boschstr. 12, 69469 Weinheim, product-safety[at]wiley[dot]com | Anbieter: preigu.
- Couverture rigide
Vendeur : AHA-BUCH GmbH, Einbeck, AllemagneAHA-BUCH GmbH
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 159,06
EUR 64,42 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Buch. Etat : Neu. Neuware - Systematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology.
- Couverture rigide
Vendeur : Rarewaves.com UK, London, Royaume-UniRarewaves.com UK
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 159,67
EUR 75,46 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardback. Etat : New. Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic… components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposesGuidelines for designing high-performance packaging materials with novel structuresAn authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
- Couverture rigide
- impression à la demande
Vendeur : Revaluation Books, Exeter, Royaume-UniRevaluation Books
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 153,59
EUR 14,51 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 2 disponible(s)
Hardcover. Etat : Brand New. 384 pages. 6.69x1.02x9.61 inches. In Stock. This item is printed on demand.
