Handbook integration volume process (1 résultats)
3D Integration Handbook Volume 3 Three-Dimensional Process Technology(Chinese Edition)
[ MEI ] FEI LI PU· JIA LUO ( Philip Garrou ) . [ RI ] XIAO LIU GUANG ZHENG ( Mitsumasa Koyanagi ) . [ DE ] BI DE· LA MU ( Peter Ramm ) . WU DAO WEI . WANG WEI . LIU JIAN JUN . YU HUAN DENG YI
Langue : anglais
- Couverture rigide
Vendeur : liu xing, Nanjing, JS, Chineliu xing
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 144,54
EUR 15,85 expéditionExpédition depuis Chine vers Etats-UnisQuantité disponible : 3 disponible(s)
Hardcover. Etat : New. HardCover.Pub Date:2022-10 Pages:369 Language:ChinesePublisher:China Aerospace PressSelf-operated3D Integration Handbook Volume 3 Three-Dimensional Process Technologyis divided into 22 chapters. namely: 3D IC integration since 2008. main applications and market trends of 3D integration and interposer techn…ology. economic drivers and barriers to 2.5D/3D integration. interposer technology. TSV manufacturing overview. TSV unit process and integration. TSV preparation of ASET. laser-assisted wafe.
