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Langue: anglais
Edité par John Wiley & Sons Inc, New York, 2020
ISBN 10 : 1119482038 ISBN 13 : 9781119482031
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Ajouter au panierHardcover. Etat : new. Hardcover. Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: Developments in process engineering (SMT, Wave, Rework, Paste Technology) Low temperature, high temperature and high reliability alloys Intermetallic compounds PCB surface finishes and laminates Underfills, encapsulants and conformal coatings Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the books explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Langue: anglais
Edité par John Wiley and Sons Ltd, 2020
ISBN 10 : 1119482038 ISBN 13 : 9781119482031
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Ajouter au panierHardcover. Etat : Brand New. 481 pages. 9.25x6.25x1.00 inches. In Stock.
Langue: anglais
Edité par John Wiley & Sons Inc, New York, 2020
ISBN 10 : 1119482038 ISBN 13 : 9781119482031
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Ajouter au panierHardcover. Etat : new. Hardcover. Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: Developments in process engineering (SMT, Wave, Rework, Paste Technology) Low temperature, high temperature and high reliability alloys Intermetallic compounds PCB surface finishes and laminates Underfills, encapsulants and conformal coatings Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the books explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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Ajouter au panierEtat : New. 2020. 1st Edition. Hardcover. . . . . . Books ship from the US and Ireland.
Langue: anglais
Edité par John Wiley & Sons Inc, New York, 2020
ISBN 10 : 1119482038 ISBN 13 : 9781119482031
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Ajouter au panierHardcover. Etat : new. Hardcover. Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: Developments in process engineering (SMT, Wave, Rework, Paste Technology) Low temperature, high temperature and high reliability alloys Intermetallic compounds PCB surface finishes and laminates Underfills, encapsulants and conformal coatings Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the books explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.