Modeling simulation high speed (32 résultats)

Etat : good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.

21 x 15 cm. Etat : Gut. Band 77. XIV, 153 Seiten ; Mit Abbildungen Schriften aus dem Institut für Technische und Numerische Mechanik der Universität Stuttgart ; Softcover, original Broschur, Deckel aufgebogen. Innen in sehr gutem Zustand. In Englisch. Bitte beachten Sie unsere Bilder. B16-04-04E|S43 Sprache: Englisch Gewicht in Gramm: 195.…

Hardcover. Etat : Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Hardcover. Etat : Fair. No Jacket. Missing dust jacket; Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Etat : acceptable. Fairly worn, but readable and intact. If applicable: Dust jacket, disc or access code may not be included.

Hardcover. Etat : Good. No Dust Jacket. Hardcover without jacket. Minor dents on rear upper edge; leading corners are very slightly bent and worn. Spine head a little bumped. A few superficial scores elsewhere on boards. Previous owner's name inked on FEP. Small stain on rear pastedown, imprinted onto BEP. Pages remain sound and clean; text and diagrams clear throughout. Reprinted from a Special Issue of 'Analog Integrated Circuits and Signal Processing: An International Journal', Vol. 5, No. 1 (1994). TS. Used.…

hardcover. Etat : New. In shrink wrap. Looks like an interesting title.

Hardcover. Etat : Very Fine. First Edition. No markings.

Etat : New.

Etat : New.

Hardcover. Etat : New. HARDCOVER, BRAND NEW COPY, Perfect Shape, No Black Remainder Mark, 517-709Fast Shipping With Online Tracking, International Orders shipped Global Priority Air Mail, All orders handled with care and shipped promptly in secure packaging, we ship Mon-Sat and send shipment confirmation emails. Our customer service is friendly, we answer emails fast, accept returns and work hard to deliver 100% Customer Satisfaction.…

Etat : As New. Unread book in perfect condition.

Etat : New. In English.

Etat : New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . .…

Etat : New.

Etat : As New. Unread book in perfect condition.

Etat : New. pp. 108 Softcover Reprint of the Original 1st Edition, 1994.

hardcover. Etat : New. In shrink wrap. Looks like an interesting title.

Etat : New. pp. 112.

Taschenbuch. Etat : Neu. Modeling and Simulation of High Speed VLSI Interconnects | A Special Issue of Analog Integrated Circuits and Signal Processing An International Journal Vol. 5, No. 1 (1994) | Michel S. Nakhla (u. a.) | Taschenbuch | 108 S. | Englisch | 2012 | Springer | EAN 9781461361718 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Etat : New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . . Books ship from the US and Ireland.…

Gebunden. Etat : New. Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnec.

Paperback. Etat : Brand New. reprint edition. 106 pages. 10.20x7.60x0.40 inches. In Stock.

Etat : gut. 2023. Dynamics of High-Speed Maglev Trains: Modeling and Simulation with the Multibody Systems Approach In deutscher Sprache. pages.

Etat : new. Questo è un articolo print on demand.

Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field. 112 pp. Englisch.…

Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnec.…

Etat : New. Print on Demand pp. 108.

Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area.Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.Libri GmbH, Europaallee 1, 36244 Bad Hersfeld 112 pp. Englisch.…

Etat : New. PRINT ON DEMAND pp. 108.