Structural dynamics electronic photonic (19 résultats)
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Vendeur : Romtrade Corp., STERLING HEIGHTS, MI, Etats-UnisRomtrade Corp.
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EUR 88,27
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Etat : New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Vendeur : Basi6 International, Irving, TX, Etats-UnisBasi6 International
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EUR 89,34
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Etat : Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Vendeur : Books Puddle, New York, NY, Etats-UnisBooks Puddle
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EUR 117,63
EUR 3,41 expéditionExpédition nationale : Etats-UnisQuantité disponible : 1 disponible(s)
Etat : Used.
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Vendeur : Majestic Books, Hounslow, Royaume-UniMajestic Books
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EUR 119,98
EUR 7,59 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Etat : Used.
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Vendeur : Biblios, frankfurt am main, HESSE, AllemagneBiblios
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EUR 124,12
EUR 9,95 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Etat : Used.
- Couverture rigide
Vendeur : INDOO, Avenel, NJ, Etats-UnisINDOO
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EUR 159,07
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Etat : New.
Structural Dynamics of Electronic and Photonic Systems
Suhir, Ephraim (EDT); Yu, T. X. (EDT); Steinberg, David S. (EDT)
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Vendeur : GreatBookPrices, Columbia, MD, Etats-UnisGreatBookPrices
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EUR 156,77
EUR 2,26 expéditionExpédition nationale : Etats-UnisQuantité disponible : Plus de 20 disponibles
Etat : New.
- Couverture rigide
- Édition originale
Vendeur : Grand Eagle Retail, Bensenville, IL, Etats-UnisGrand Eagle Retail
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EUR 199,20
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Hardcover. Etat : new. Hardcover. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable st…ructure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
- Couverture souple
Vendeur : Mispah books, Redhill, SURRE, Royaume-UniMispah books
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EUR 189,97
EUR 29,18 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Mass Market Paperback. Etat : Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Vendeur : Ubiquity Trade, Miami, FL, Etats-UnisUbiquity Trade
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EUR 229,76
EUR 2,57 expéditionExpédition nationale : Etats-UnisQuantité disponible : Plus de 20 disponibles
Etat : New. Brand new! Please provide a physical shipping address.
Structural Dynamics of Electronic and Photonic Systems
Suhir, Ephraim (EDT); Yu, T. X. (EDT); Steinberg, David S. (EDT)
- Couverture rigide
Vendeur : GreatBookPricesUK, Woodford Green, Royaume-UniGreatBookPricesUK
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EUR 216,66
EUR 17,51 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Etat : New.
- Couverture rigide
- Édition originale
Vendeur : Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandeKennys Bookshop and Art Galleries Ltd.
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EUR 220,64
EUR 9,50 expéditionExpédition depuis Irlande vers Etats-UnisQuantité disponible : 15 disponible(s)
Etat : New. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Editor(s): Suhir, Ephraim; Yu, T. X.; Steinberg, David S.; Connal…ly, Eric. Num Pages: 608 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 244 x 201 x 36. Weight in Grams: 1180. . 2011. 1st Edition. Hardcover. . . . .
- Couverture rigide
- Édition originale
Vendeur : CitiRetail, Stevenage, Royaume-UniCitiRetail
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EUR 224,21
EUR 43,19 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : new. Hardcover. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable st…ructure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Structural Dynamics of Electronic and Photonic Systems
Suhir, Ephraim (EDT); Yu, T. X. (EDT); Steinberg, David S. (EDT)
- Couverture rigide
Vendeur : GreatBookPricesUK, Woodford Green, Royaume-UniGreatBookPricesUK
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Occasion - Comme neuf
EUR 256,08
EUR 17,51 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Etat : As New. Unread book in perfect condition.
- Couverture rigide
Vendeur : moluna, Greven, Allemagnemoluna
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EUR 216,76
EUR 48,99 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : Plus de 20 disponibles
Gebunden. Etat : New. Dr. EPHRAIM SUHIR is Fellow of the IEEE, ASME, APS, IoP (UK), and the SPE. He is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine cofounder of the ASME Journal of Electronic Packaging holds twenty-two U.S. patents and has.
- Couverture rigide
Vendeur : Mispah books, Redhill, SURRE, Royaume-UniMispah books
Contacter le vendeurVendeur avec une évaluation de 4 étoilesEtat: Occasion - Comme neuf
EUR 246,47
EUR 29,18 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Couverture rigide
Vendeur : Kennys Bookstore, Olney, MD, Etats-UnisKennys Bookstore
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EUR 271,47
EUR 8,99 expéditionExpédition nationale : Etats-UnisQuantité disponible : 15 disponible(s)
Etat : New. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Editor(s): Suhir, Ephraim; Yu, T. X.; Steinberg, David S.; Connal…ly, Eric. Num Pages: 608 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 244 x 201 x 36. Weight in Grams: 1180. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.
Structural Dynamics of Electronic and Photonic Systems
Suhir, Ephraim (EDT); Yu, T. X. (EDT); Steinberg, David S. (EDT)
- Couverture rigide
Vendeur : GreatBookPrices, Columbia, MD, Etats-UnisGreatBookPrices
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Occasion - Comme neuf
EUR 281,68
EUR 2,26 expéditionExpédition nationale : Etats-UnisQuantité disponible : Plus de 20 disponibles
Etat : As New. Unread book in perfect condition.
- Couverture rigide
- Édition originale
Vendeur : AussieBookSeller, Truganina, VIC, AustralieAussieBookSeller
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EUR 324,31
EUR 31,66 expéditionExpédition depuis Australie vers Etats-UnisQuantité disponible : 1 disponible(s)
Hardcover. Etat : new. Hardcover. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable st…ructure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
