Three Dimensional System Integration: IC Stacking Process and Design - Couverture souple

9781489981820: Three Dimensional System Integration: IC Stacking Process and Design

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ISBN 10 : 1489981829 ISBN 13 : 9781489981820

Editeur : Springer, 2014

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

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�diteur: Springer
Date d'�dition: 2014
Langue: anglais
ISBN 10: 1489981829
ISBN 13: 9781489981820
Reliure: Broch�
Nombre de pages: 256
�diteur: Papanikolaou Antonis, Soudris Dimitrios, Radojcic Riko
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9781441909619: Three Dimensional System Integration: IC Stacking Process and Design

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ISBN 10 : 1441909613 ISBN 13 : 9781441909619
Editeur : Springer-Verlag New York Inc., 2010
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Springer, 2011 (Couverture souple)

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Three Dimensional System Integration

Papanikolaou, Antonis|Soudris, Dimitrios|Radojcic, Riko

Edit� par Springer US, 2014

ISBN 10 : 1489981829 ISBN 13 : 9781489981820

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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her workProv. N� de r�f. du vendeur 11466517

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Three Dimensional System Integration

Antonis Papanikolaou

Edit� par Springer US Sep 2014, 2014

ISBN 10 : 1489981829 ISBN 13 : 9781489981820

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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. 256 pp. Englisch. N� de r�f. du vendeur 9781489981820

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Three Dimensional System Integration : IC Stacking Process and Design

Antonis Papanikolaou

Edit� par Springer US, Springer New York, 2014

ISBN 10 : 1489981829 ISBN 13 : 9781489981820

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Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne

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Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. N� de r�f. du vendeur 9781489981820

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Three Dimensional System Integration

Antonis Papanikolaou

Edit� par Springer US, Springer US Sep 2014, 2014

ISBN 10 : 1489981829 ISBN 13 : 9781489981820

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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 256 pp. Englisch. N� de r�f. du vendeur 9781489981820

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