Edité par Omniscriptum Mär 2026, 2026
ISBN 10 : 6130993706 ISBN 13 : 9786130993702
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
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Ajouter au panierTaschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-level optics (WLO) enables the design and manufacture of miniaturized optics at the wafer level using advanced semiconductor-like techniques. The end product is cost effective, miniaturized optics that enable the reduced form factor of camera modules for mobile devices. The technology is scalable from a single-element CIF/VGA lens to a multi-element mega pixel lens structure, where the lens wafers are precision aligned, bonded together and diced to form multi-element lens stacks. 76 pp. Englisch.
Edité par OmniScriptum, 2026
ISBN 10 : 6130993706 ISBN 13 : 9786130993702
Vendeur : preigu, Osnabrück, Allemagne
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Ajouter au panierTaschenbuch. Etat : Neu. Wafer-Level Optics | Wafer (Electronics), Semiconductor, Mobile Devices, Mega Pixel, Silicon Crystal, Integrated Circuits | Lambert M. Surhone (u. a.) | Taschenbuch | Englisch | 2026 | OmniScriptum | EAN 9786130993702 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu Print on Demand.
Edité par Omniscriptum Mär 2026, 2026
ISBN 10 : 6130993706 ISBN 13 : 9786130993702
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
EUR 136
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Ajouter au panierTaschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Please note that the content of this book primarily consists of articlesavailable from Wikipedia or other free sources online. Wafer-leveloptics (WLO) enables the design and manufacture of miniaturized opticsat the wafer level using advanced semiconductor-like techniques. The endproduct is cost effective, miniaturized optics that enable the reducedform factor of camera modules for mobile devices. The technology isscalable from a single-element CIF/VGA lens to a multi-element megapixel lens structure, where the lens wafers are precision alignedbonded together and diced to form multi-element lens stacks.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 76 pp. Englisch.