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Etat : good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.…

Etat : Very Good. 1st Edition. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.…

Etat : New.

Etat : New.

Etat : New.

Etat : New. In English.

Etat : New.

Etat : Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

Etat : New. pp. 224.

Etat : New. pp. 209.

Etat : New. In English.

Hardcover. Etat : Brand New. 219 pages. 9.25x6.50x0.50 inches. In Stock.

Etat : New. In English.

Etat : New.

Etat : New.

Etat : New. In English.

Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Design of Systems on a Chip: Design&Test is the second of two volumes addressing the design challenges associated with new generations of the semiconductor technology. The various chapters are the compilations of tutorials presented at workshops in the recent years by prominent authors from all over the world. Technology, productivity and quality are the main aspects under consideration to establish the major requirements for the design and test of upcoming systems on a chip. In particular this second book include contributions on three different, but complementary axes: core design, computer-aided design tools and test methods. A collection of chapters deal with the heterogeneity aspect of core designs, showing the diversity of parts that may share the same substrate in a state-of-the-art system on a chip. The second part of the book discusses CAD in three different levels of design abstraction, from system level to physical design. The third part deals with test methods. The topic is addressed from different viewpoints: in terms of chip complexity, test is discussed from the core and system prospective; in terms of signal heterogeneity, the digital, mixed-signal and microsystem prospective are considered.Fault-tolerance in integrated circuits is not an exclusive concern regarding space designers or highly-reliable application engineers. Rather, designers of next generation products must cope with reduced margin noises due to technological advances. The continuous evolution of the fabrication technology process of semiconductor components, in terms of transistor geometry shrinking, power supply, speed, and logic density, has significantly reduced the reliability of very deep submicron integrated circuits, in face of the various internal and external sources of noise. The very popular Field Programmable Gate Arrays, customizable by SRAM cells, are a consequence of the integrated circuit evolution with millions of memory cells to implement the logic, embedded memories, routing, and more recently with embedded microprocessors cores. These re-programmable systems-on-chip platforms must be fault-tolerant to cope with present days requirements. This book discusses fault-tolerance techniques for SRAM-based Field Programmable Gate Arrays (FPGAs). It starts by showing the model of the problem and the upset effects in the programmable architecture. In the sequence, it shows the main fault tolerance techniques used nowadays to protect integrated circuits against errors. A large set of methods for designing fault tolerance systems in SRAM-based FPGAs is described. Some presented techniques are based on developing a new fault-tolerant architecture with new robustness FPGA elements. Other techniques are based on protecting the high-level hardware description before the synthesis in the FPGA. The reader has the flexibility of choosing the most suitable fault-tolerance technique for its project and to compare a set of fault toleranttechniques for programmable logic applications.…

Etat : As New. Unread book in perfect condition.

Taschenbuch. Etat : Neu. Design of Systems on a Chip: Design and Test | Ricardo Reis (u. a.) | Taschenbuch | x | Englisch | 2010 | Springer | EAN 9781441940896 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Etat : New. pp. 244.

Etat : As New. Unread book in perfect condition.

Etat : As New. Unread book in perfect condition.

Etat : New. pp. 244 Illus.

Paperback. Etat : Brand New. 297 pages. 9.00x6.00x0.55 inches. In Stock.

Paperback. Etat : Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Etat : As New. Unread book in perfect condition.

Hardcover. Etat : Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Etat : As New. Unread book in perfect condition.

Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Global interconnect solutions based on long wires, like buses, are being replaced by solutions based on shared and segmented wires, like Networks-on-Chip (NoCs), to reduce the cost of global interconnect. A conventional Test Access Mechanism (TAM), which consists of long wires, is also subject to these problems. For this reason, this book studies the reuse of on-chip networks for test data transportation, avoiding dedicated TAMs. This book presents an overall test methodology for NoC-based SoCs which consists of steps to build optimized test wrappers and test scheduling. The test wrappers hide the NoC from the rest of the test architecture, thus, the cores and the test equipment work exactly like they would work in a conventional test architecture. Thus, the proposed wrapper is compatible with previous approaches, like the IEEE Std. 1500. The test scheduling optimizes the chip test length without requiring full knowledge of the NoC, contributing to the generality of the proposed test methodology. Several benchmarks are applied to the conventional and to the proposed test approaches to compare the resulting chip test length and silicon area overhead.…

Etat : new. Questo è un articolo print on demand.