vasilis pavlidis (22 résultats)

1st ed. 19 x 24 cm. 336 pages. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.

hardcover. Etat : Very Good. Etat de la jaquette : No Dust Jacket. First Edition. Hard cover without jacket. Book is in very good condition; very light wear in a couple of places to edges and corners. Previous owner's name on FEP; Contents are otherwise clean, bright and tight. J. Used.

Etat : New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Etat : Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Brand new book. Fast ship. Please provide full street address as we are not able to ship toPOboxaddress.

Etat : New. pp. xv + 309.

Etat : New. pp. xv + 309 Illus.

Paperback. Etat : Brand New. 1st edition. 336 pages. 9.25x7.50x1.00 inches. In Stock.

Paperback / softback. Etat : New. New copy - Usually dispatched within 4 working days. 869.

Etat : New. pp. 496.

Etat : New. pp. xv + 309.

Paperback. Etat : Brand New. 2nd edition. 718 pages. 9.00x7.25x2.00 inches. In Stock.

Etat : New. pp. 496.

Etat : New. pp. 496.

paperback. Etat : New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Pub Date :2013-09-01 Pages: 224 Publisher: Machinery Industry Press at the end of the first decade of the 21st century . based on 3D integration technology. More than Moore era quietly arrived. Have multiple active devices planes 3D IC (3DIC). is expected to provide a compact. flexible cabling . transmission speed and the number of multi- channel interconnect structures . thus providing breakthrough interconnect bottleneck for the effective IC designers means . but also to the effective integ.Four Satisfaction guaranteed,or money back.

Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -With vastly increased complexity and functionality in the 'nanometer era' (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future.This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits.Demonstrates how to overcome 'interconnect bottleneck' with 3-D integrated circuit design.leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designersThe FIRST book on 3-D integrated circuit design.provides up-to-date information that is otherwise difficult to findFocuses on design issues key to the product development cycle.good design plays a major role in exploiting the implementation flexibilities offered in the 3-DProvides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization.offers practical view of designing 3-D circuits 336 pp. Englisch.

Etat : new. Questo è un articolo print on demand.

Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - With vastly increased complexity and functionality in the 'nanometer era' (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits.

Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogen.

Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization 768 pp. Englisch.

Etat : new. Questo è un articolo print on demand.

Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires.