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Hardcover. Etat : As New. 1st Edition. First Edition. Original boards. As New. No Dust Jacket.

Paperback. Etat : new. Paperback. th This volume contains the papers selected for the 13 FIRA Robot World Congress, held at Amrita Vishwa Vidyapeetham Bangalore, India, September 15-17, 2010. The Federation of International Robot-soccer Association (FIRA is a non-profit organization that annually organizes robotic competitions and meetings around the globe. The robot soccer competitions started in 1996, and FIRA was est- lished on, June 5, 1997. The robot soccer competitions are aimed at promoting the spirit of science and technology to the younger generation. The congress is a forum to share ideas and future directions of technologies, and to enlarge the human networks in the robotics area. The objectives of the FIRA Cup and Congress are to explore the technical dev- opments and achievements in the field of robotics, and provide participants with a robot festival including technical presentations, robot soccer competitions, and exh- its under the theme Where Theory and Practice Meet. FIRA India aims to propagate and popularize robotics and robotic competitions across India. A book constitutes the proceedings of the 15th Robot World Cup and Congress on Trends in Intelligent Robotics that was held in Bangalore, India, in September 15-19,2010. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Etat : Good. : Este libro es una guía completa sobre el estado del arte y la dirección futura de la tecnología de interconexión de cobre. Debido a sus ventajas de rendimiento, la metalización de cobre para la interconexión de circuitos integrados está atrayendo un gran interés en la comunidad de semiconductores en todo el mundo. Los autores se basan en más de una década de participación en la investigación de interconexión de cobre, integrando grandes cantidades de conocimiento disponible y aclarando la conexión entre los principios mecanicistas y las tecnologías relevantes. Cuenta con amplias referencias, tablas y más de 100 ilustraciones, incluyendo el patrón de doble Damasceno necesario para las interconexiones de cobre. EAN: 9780471252566 Tipo: Libros Categoría: Tecnología|Ciencias Título: Copper-Fundamental Mechanisms for Microelectronic Applications Autor: Shyam P. Murarka| Igor V. Verner| Ronald J. Gutmann Editorial: Wiley-Interscience Idioma: en Páginas: 384 Formato: tapa dura.…

Paperback. Etat : Brand New. 370 pages. 9.10x6.10x0.80 inches. In Stock.

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Kartoniert / Broschiert. Etat : New. up-to-date resultsfast track conference proceedingsstate-of-the-art reviewth This volume contains the papers selected for the 13 FIRA Robot World Congress, held at Amrita Vishwa Vidyapeetham Bangalore, India, September 15-17, 2010. The Federation of Int.

Etat : New. pp. xiii + 370 1st Edition.

Etat : New. pp. xiii + 370 Illus.

Etat : New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

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Etat : Sehr gut. Zustand: Sehr gut | Seiten: 370 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Hardcover. Etat : Sehr gut. 232 Seiten Zustand: SEHR GUTER Zustand! HC1-137-4/8-00100142 Sprache: Deutsch Gewicht in Gramm: 362.