Edité par Springer Berlin Heidelberg, 2012
ISBN 10 : 3642327699 ISBN 13 : 9783642327698
Langue: anglais
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
EUR 53,49
Autre deviseQuantité disponible : 1 disponible(s)
Ajouter au panierBuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
EUR 77,21
Autre deviseQuantité disponible : 4 disponible(s)
Ajouter au panierEtat : New. pp. 200.
Edité par Springer Berlin Heidelberg, 2012
ISBN 10 : 3642327699 ISBN 13 : 9783642327698
Langue: anglais
Vendeur : moluna, Greven, Allemagne
EUR 48,37
Autre deviseQuantité disponible : Plus de 20 disponibles
Ajouter au panierEtat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. State-of-the-art research Fast-track conference proceedings Unique visibilityThis book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale In.
Edité par Springer Berlin Heidelberg Aug 2012, 2012
ISBN 10 : 3642327699 ISBN 13 : 9783642327698
Langue: anglais
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
EUR 53,49
Autre deviseQuantité disponible : 2 disponible(s)
Ajouter au panierBuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems. 200 pp. Englisch.
Edité par Springer Berlin Heidelberg, Springer Berlin Heidelberg Aug 2012, 2012
ISBN 10 : 3642327699 ISBN 13 : 9783642327698
Langue: anglais
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
EUR 53,49
Autre deviseQuantité disponible : 1 disponible(s)
Ajouter au panierBuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 200 pp. Englisch.
Vendeur : Majestic Books, Hounslow, Royaume-Uni
EUR 79,47
Autre deviseQuantité disponible : 4 disponible(s)
Ajouter au panierEtat : New. Print on Demand pp. 200 104 Illus.
EUR 81,53
Autre deviseQuantité disponible : 4 disponible(s)
Ajouter au panierEtat : New. PRINT ON DEMAND pp. 200.