Cooling electronic systems (20 résultats)

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Hardcover. Etat : with no dust jacket. No Dust Jacket. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Slight pine twist. Else binding clean. A few faint smudges on page edges. Else pages clean, but for library markings. This is a fairly heavy book; Priority and/or International…may require shipping over and above standard costs. ; TEH22A; 9.5 x 6.5"; 962 pages; Ex-Library.

Langue : anglais
Edité par Independently published, 2025
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Taschenbuch. Etat : Neu. A Comprehensive Study on Heat Transfer in Electronic Cooling Systems | Flow optimization of heat sinks for different Al/Cu compositions | Ramesha Hanumanthrappa (u. a.) | Taschenbuch | Englisch | 2022 | LAP LAMBERT Academic Publishing | EAN 9786204740263 | Verantwortliche Person für die EU: preigu GmbH &… Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.

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Etat : Hervorragend. Zustand: Hervorragend | Seiten: 984 | Sprache: Englisch | Produktart: Bücher | Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and therma…l sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, togetherwith a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

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Vendeur : moluna, Greven, Allemagnemoluna
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Etat : New.

Langue : anglais
Edité par Springer Netherlands, Springer Netherlands, 2013
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Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become i…nvolved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, togetherwith a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

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Vendeur : California Books, Miami, FL, Etats-UnisCalifornia Books
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Edité par Kluwer Academic Publishers., Dordrecht., 1994
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Ajouter au panierWhite glossy boards. Etat : Near Fine. A near fine unmarked copy. 8vo. x, 962 pp.

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Paperback. Etat : new. Paperback. Electronic equipment has become the backbone of modern society. From datacenters and telecommunications systems to industrial automation panels, UPS installations, LED display systems, and intelligent buildings, electronic devices now support nearly every sector of industry and infrastructure. A…s equipment capacities increase and electronics become more compact, the challenge of heat removal and ventilation grows more critical.One of the most overlooked causes of electronic equipment failure is inadequate thermal management. Excessive temperatures, poor airflow distribution, contamination, humidity, and improper ventilation can significantly reduce equipment life, increase downtime, and create operational risks. In many facilities, failures attributed to "electrical problems" are often rooted in cooling deficiencies or poor environmental control.This book was written to provide practical and technical guidance on the ventilation and cooling of electronic equipment. It covers a broad range of applications including IT racks, server rooms, UPS systems, electrical cabinets, PLC enclosures, control rooms, battery rooms, telecommunications equipment, and large LED display systems. The objective is to bridge the gap between HVAC engineering, electrical engineering, facility operations, and thermal management.The book explains both the fundamentals and advanced practices used in modern electronic cooling systems. Topics include airflow principles, cabinet ventilation, precision cooling systems, rack cooling strategies, battery room ventilation, CFD airflow analysis, energy-efficient cooling methods, and future trends such as liquid cooling and AI-driven thermal optimization.Special attention is given to practical engineering applications, field challenges, reliability considerations, and real-world operational concerns. The content is intended to help engineers and facility professionals design safer, more efficient, and more reliable environments for sensitive electronic equipment.As industries continue moving toward higher computing densities, smart infrastructure, edge computing, industrial automation, and digital transformation, the importance of thermal management will only increase. Proper ventilation and cooling are no longer secondary considerations; they are essential parts of operational continuity, energy efficiency, and equipment protection.It is my hope that this book will serve as a valuable technical reference for professionals, students, consultants, operators, and organizations involved in the design, operation, maintenance, and optimization of electronic equipment environments.- Charles NehmeCFN-HVAC This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AllemagneBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amount of…heat during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and is still constantly increasing. Conventional passive cooling technologies using air or water as working fluid, such as the microchannel sink, cannot fully meet the heat dissipation requirement and active cooling methods should be applied. Due to the limited installation space in electronic packages, conventional bulk cooling systems are too big. TE coolers combined with air cooling or liquid cooling approach at the hot sideshow have great potential because of their small size, high reliability, and no noise. 128 pp. Englisch.

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Paperback. Etat : new. Paperback. Electronic equipment has become the backbone of modern society. From datacenters and telecommunications systems to industrial automation panels, UPS installations, LED display systems, and intelligent buildings, electronic devices now support nearly every sector of industry and infrastructure. A…s equipment capacities increase and electronics become more compact, the challenge of heat removal and ventilation grows more critical.One of the most overlooked causes of electronic equipment failure is inadequate thermal management. Excessive temperatures, poor airflow distribution, contamination, humidity, and improper ventilation can significantly reduce equipment life, increase downtime, and create operational risks. In many facilities, failures attributed to "electrical problems" are often rooted in cooling deficiencies or poor environmental control.This book was written to provide practical and technical guidance on the ventilation and cooling of electronic equipment. It covers a broad range of applications including IT racks, server rooms, UPS systems, electrical cabinets, PLC enclosures, control rooms, battery rooms, telecommunications equipment, and large LED display systems. The objective is to bridge the gap between HVAC engineering, electrical engineering, facility operations, and thermal management.The book explains both the fundamentals and advanced practices used in modern electronic cooling systems. Topics include airflow principles, cabinet ventilation, precision cooling systems, rack cooling strategies, battery room ventilation, CFD airflow analysis, energy-efficient cooling methods, and future trends such as liquid cooling and AI-driven thermal optimization.Special attention is given to practical engineering applications, field challenges, reliability considerations, and real-world operational concerns. The content is intended to help engineers and facility professionals design safer, more efficient, and more reliable environments for sensitive electronic equipment.As industries continue moving toward higher computing densities, smart infrastructure, edge computing, industrial automation, and digital transformation, the importance of thermal management will only increase. Proper ventilation and cooling are no longer secondary considerations; they are essential parts of operational continuity, energy efficiency, and equipment protection.It is my hope that this book will serve as a valuable technical reference for professionals, students, consultants, operators, and organizations involved in the design, operation, maintenance, and optimization of electronic equipment environments.- Charles NehmeCFN-HVAC This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.

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Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a…huge amount of heat during operation.

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Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagnebuchversandmimpf2000
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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amount of heat… during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and is still constantly increasing. Conventional passive cooling technologies using air or water as working fluid, such as the microchannel sink, cannot fully meet the heat dissipation requirement and active cooling methods should be applied. Due to the limited installation space in electronic packages, conventional bulk cooling systems are too big. TE coolers combined with air cooling or liquid cooling approach at the hot sideshow have great potential because of their small size, high reliability, and no noise.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 128 pp. Englisch.

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Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amount of heat…during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and is still constantly increasing. Conventional passive cooling technologies using air or water as working fluid, such as the microchannel sink, cannot fully meet the heat dissipation requirement and active cooling methods should be applied. Due to the limited installation space in electronic packages, conventional bulk cooling systems are too big. TE coolers combined with air cooling or liquid cooling approach at the hot sideshow have great potential because of their small size, high reliability, and no noise.

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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal scie…nces to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers. 984 pp. Englisch.

Langue : anglais
Edité par Springer Netherlands, Springer Netherlands Okt 2013, 2013
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Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences… to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book.Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, togetherwith a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics.Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 984 pp. Englisch.

Edité par OmniScriptum, 2026
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Taschenbuch. Etat : Neu. Heat Sink | Computer cooling, Heat pipe, Heat pump, Radiator, Thermal management of electronic devices and systems, Thermal resistance in electronics, Refrigeration | Frederic P. Miller (u. a.) | Taschenbuch | Englisch | 2026 | OmniScriptum | EAN 9786130214999 | Verantwortliche Person für die EU: preigu…GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu Print on Demand.