lead free solder process development (17 résultats)

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Hardcover. Etat : new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

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Hardback. Etat : New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described.  Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.

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Etat : New. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Num Pages: 284 pages, Illustrations. BIC Classification: THX; TJF. Category: (P) Professional & Vocational. Dimension: 213 x 161 x 22. Weight in Grams: 580. . 2011. 1st Edition. Hardcover. . . . .

Hardcover. Etat : new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.

Etat : New. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Num Pages: 284 pages, Illustrations. BIC Classification: THX; TJF. Category: (P) Professional & Vocational. Dimension: 213 x 161 x 22. Weight in Grams: 580. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.

Hardback. Etat : New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described.  Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.

Hardcover. Etat : new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.