Rapid thermal integrated processing (19 résultats)
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Rapid Thermal Annealing / Chemical Vapor Deposition and Integrated Processing
Hodul, David;Green, Martin L.;Gelpey, Jeffrey C.;Green Martin L.;Seidel, Thomas E.
Langue : anglais
Edité par Materials Research Society, Warrendale, Pennsylvania, U.S.A., 1989
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Vendeur : Reader's Corner, Inc., Raleigh, NC, Etats-UnisReader's Corner, Inc.
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EUR 13,35
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Hardcover. Etat : New. No DJ. MRS Symposium Proceedings Vol 146. This is a new copy, blue faux leather binding with white lettering on the cover & spine.
Rapid Thermal Annealing/chemical Vapor Deposition and Integrated Processing: Volume 146
Hodul, David, Jeffrey C. Gelpey, Martin L. Green & Thomas E. Seidel (editors)
Langue : anglais
Edité par Materials Research Society, Pittsburgh, Pennsylvania, 1989
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Vendeur : Literary Cat Books, Machynlleth, Powys, WALES, Royaume-UniLiterary Cat Books
Contacter le vendeurVendeur avec une évaluation de 4 étoilesMembre d’une association professionnelle : IOBA
Etat: Occasion - Satisfaisant
EUR 4,34
EUR 17,54 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible(s)
Original Boards. Etat : Good. No Dust Jacket. Reprint. 494 pages. With diagrams and illustrations. Stamped Damaged to verso title page. Slight wear to covers. Bottom edge slightly stained.; Hardcover; Octavo; The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners….
Rapid Thermal and Integrated Processing II: Volume 303 (MRS Proceedings)
Gelpey, Jeffrey C.; Elliott, J. Kiefer; Wortman, Jimmie J.; Ajmera, Atul
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Vendeur : RIVERLEE BOOKS, Waltham Cross, HERTS, Royaume-UniRIVERLEE BOOKS
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EUR 59,01
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Hardcover. Etat : New. Brand new Unread but may have "damaged" stamp on one of the title pages due to cosmetic imperfection such as minor dents on cover or edge of pages or scratches on cover etc. Hardcover.
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Vendeur : Buchpark, Trebbin, AllemagneBuchpark
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EUR 42,27
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Etat : Gut. Zustand: Gut | Seiten: 455 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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Vendeur : Ria Christie Collections, Uxbridge, Royaume-UniRia Christie Collections
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EUR 437,33
EUR 14,01 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : Plus de 20 disponibles
Etat : New. In.
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Vendeur : Ria Christie Collections, Uxbridge, Royaume-UniRia Christie Collections
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EUR 437,33
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Etat : New. In.
Langue : anglais
Edité par Springer Netherlands, Springer Netherlands, 1996
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Vendeur : AHA-BUCH GmbH, Einbeck, AllemagneAHA-BUCH GmbH
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EUR 442,53
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Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the gradua…te level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Langue : anglais
Edité par Springer Netherlands, Springer Netherlands, 2010
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Vendeur : AHA-BUCH GmbH, Einbeck, AllemagneAHA-BUCH GmbH
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EUR 440,62
EUR 64,34 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the… graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
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Vendeur : Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandeKennys Bookshop and Art Galleries Ltd.
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EUR 517,38
EUR 9,50 expéditionExpédition depuis Irlande vers Etats-UnisQuantité disponible : 15 disponible(s)
Etat : New. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Editor(s): Roozeboom, Fred. Series: NATO Science Series E. Num Pages: 578 pages, biography. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235… x 155 x 31. Weight in Grams: 989. . 1996. Hardback. . . . .
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Vendeur : Kennys Bookstore, Olney, MD, Etats-UnisKennys Bookstore
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EUR 649,03
EUR 9,07 expéditionExpédition nationale : Etats-UnisQuantité disponible : 15 disponible(s)
Etat : New. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Editor(s): Roozeboom, Fred. Series: NATO Science Series E. Num Pages: 578 pages, biography. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235… x 155 x 31. Weight in Grams: 989. . 1996. Hardback. . . . . Books ship from the US and Ireland.
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Vendeur : Revaluation Books, Exeter, Royaume-UniRevaluation Books
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EUR 614,58
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Paperback. Etat : Brand New. 584 pages. 9.00x6.25x1.31 inches. In Stock.
Edité par Kluwer Academic s, 1996
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Vendeur : Buchpark, Trebbin, AllemagneBuchpark
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EUR 731,56
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Ajouter au panierEtat : Sehr gut. Zustand: Sehr gut | Produktart: Bücher | Keine Beschreibung verfügbar.
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Vendeur : moluna, Greven, Allemagnemoluna
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EUR 355,65
EUR 48,99 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : Plus de 20 disponibles
Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electric…al engineering, applied p.
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Vendeur : moluna, Greven, Allemagnemoluna
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Gebunden. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing…, electrical engineering, applied p.
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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AllemagneBuchWeltWeit Ludwig Meier e.K.
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EUR 392,69
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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are…discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage. 580 pp. Englisch.
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Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AllemagneBuchWeltWeit Ludwig Meier e.K.
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EUR 427,99
EUR 23,00 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 2 disponible(s)
Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discuss…ed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage. 582 pp. Englisch.
Langue : anglais
Edité par Springer Netherlands, Springer Netherlands Mär 1996, 1996
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Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagnebuchversandmimpf2000
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 427,99
EUR 60,00 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Buch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed a…t the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 582 pp. Englisch.
Langue : anglais
Edité par Springer Netherlands, Springer Netherlands Dez 2010, 2010
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Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagnebuchversandmimpf2000
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 427,99
EUR 60,00 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible(s)
Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are disc…ussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 580 pp. Englisch.
