Articles liés à Three Dimensional System Integration: IC Stacking Process...
Synopsis
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Les informations fournies dans la section « Synopsis » peuvent faire référence à une autre édition de ce titre.
Acheter neuf
Afficher cet article
EUR 48,74
EUR 9,70 expédition depuis Allemagne vers France
Destinations, frais et délaisAutres éditions populaires du même titre
Résultats de recherche pour Three Dimensional System Integration: IC Stacking Process...
Image d'archives
Three Dimensional System Integration : IC Stacking Process and Design
Edité par
SPRINGER US, 2010
ISBN 10 : 1441909613
ISBN 13 : 9781441909619
Ancien ou d'occasion
Couverture rigide
Vendeur : Buchpark, Trebbin, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Etat : Sehr gut. Zustand: Sehr gut | Seiten: 246 | Sprache: Englisch | Produktart: Bücher. N° de réf. du vendeur 5580211/12
Quantité disponible : 1 disponible(s)
Image fournie par le vendeur
Three Dimensional System Integration
impression à la demandeVendeur : moluna, Greven, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Gebunden. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her workProv. N° de réf. du vendeur 4172145
Quantité disponible : Plus de 20 disponibles
Image d'archives
Three Dimensional System Integration: IC Stacking Process and Design
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. In. N° de réf. du vendeur ria9781441909619_new
Quantité disponible : Plus de 20 disponibles
Image fournie par le vendeur
Three Dimensional System Integration
Edité par
SPRINGER US Dez 2010, 2010
ISBN 10 : 1441909613
ISBN 13 : 9781441909619
Neuf
Couverture rigide
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. 246 pp. Englisch. N° de réf. du vendeur 9781441909619
Quantité disponible : 2 disponible(s)
Image fournie par le vendeur
Three Dimensional System Integration : IC Stacking Process and Design
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
Évaluation du vendeur 5 sur 5 étoiles
Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. N° de réf. du vendeur 9781441909619
Quantité disponible : 2 disponible(s)
Image fournie par le vendeur
Three Dimensional System Integration : IC Stacking Process and Design
Vendeur : GreatBookPrices, Columbia, MD, Etats-Unis
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. N° de réf. du vendeur 6846762-n
Quantité disponible : Plus de 20 disponibles
Image d'archives
Three Dimensional System Integration
Vendeur : Books Puddle, New York, NY, Etats-Unis
Évaluation du vendeur 4 sur 5 étoiles
Etat : New. N° de réf. du vendeur 263092593
Quantité disponible : 1 disponible(s)
Image d'archives
Three Dimensional System Integration: IC Stacking Process and Design
Edité par
Springer-Verlag New York Inc., 2010
ISBN 10 : 1441909613
ISBN 13 : 9781441909619
Neuf
Couverture rigide
Vendeur : THE SAINT BOOKSTORE, Southport, Royaume-Uni
Évaluation du vendeur 5 sur 5 étoiles
Hardback. Etat : New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 567. N° de réf. du vendeur C9781441909619
Quantité disponible : Plus de 20 disponibles
Image fournie par le vendeur
Three Dimensional System Integration : IC Stacking Process and Design
Vendeur : GreatBookPricesUK, Woodford Green, Royaume-Uni
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. N° de réf. du vendeur 6846762-n
Quantité disponible : Plus de 20 disponibles
Image d'archives
Three Dimensional System Integration
Vendeur : Majestic Books, Hounslow, Royaume-Uni
Évaluation du vendeur 5 sur 5 étoiles
Etat : New. pp. 256 100 Illus. N° de réf. du vendeur 5803950
Quantité disponible : 1 disponible(s)