Three Dimensional System Integration: IC Stacking Process and Design - Couverture rigide

Couverture rigide

ISBN 10 : 1441909613 ISBN 13 : 9781441909619

Editeur : Springer-Verlag New York Inc., 2010

Synopsis

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Détails de l'édition

• Éditeur: Springer-Verlag New York Inc.
• Date d'édition: 2010
• Langue: anglais
• ISBN 10: 1441909613
• ISBN 13: 9781441909619
• Reliure: Relié
• Nombre de pages: 246
• Éditeur: Papanikolaou Antonis, Soudris Dimitrios, Radojcic Riko
• Coordonnées du fabricant: Springer-Verlag GmbH; customerservice@springernature.com; ; Tiergartenstraße 17; Heidelberg; Baden-Württemberg; 69121; Allemagne