Nealey paul (4 résultats)

Langue : anglais
Edité par Woodhead Publishing, 2015
Série : Livre 89 sur 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Couverture rigide
Vendeur : Speedyhen, Hertfordshire, Royaume-UniSpeedyhen
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 161,22
EUR 48,62 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible
Etat : NEW.

Langue : anglais
Edité par Woodhead Publishing, 2015
Série : Livre 89 sur 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Couverture rigide
Vendeur : Ria Christie Collections, Uxbridge, Royaume-UniRia Christie Collections
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 214,96
EUR 11,11 expéditionExpédition depuis Royaume-Uni vers Etats-UnisQuantité disponible : 1 disponible
Etat : New. In English.

Langue : anglais
Edité par Elsevier Science & Technology Aug 2015, 2015
Série : Livre 89 sur 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Couverture rigide
- impression à la demande
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AllemagneBuchWeltWeit Ludwig Meier e.K.
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 165,00
EUR 23,00 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 2 disponibles
Buch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology. Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new processing methods for DSA. Part 2 then goes on to outline the key modelling and characterization principles of DSA, reviewing templates and patterning using topographical and chemically modified surfaces, line edge roughness and dimensional control, x-ray scattering for characterization, and nanoscale driven assembly. Finally, Part 3 discusses application areas and related issues for DSA in nano-manufacturing, including for basic logic circuit design, the inverse DSA problem, design decomposition and the modelling and analysis of large scale, template self-assembly manufacturing techniques. 328 pp. Englisch.…

Langue : anglais
Edité par Elsevier Science, 2015
Série : Livre 89 sur 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Couverture rigide
- impression à la demande
Vendeur : AHA-BUCH GmbH, Einbeck, AllemagneAHA-BUCH GmbH
Contacter le vendeurVendeur avec une évaluation de 5 étoilesEtat: Neuf
EUR 197,59
EUR 35,00 expéditionExpédition depuis Allemagne vers Etats-UnisQuantité disponible : 1 disponible
Buch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology. Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new processing methods for DSA. Part 2 then goes on to outline the key modelling and characterization principles of DSA, reviewing templates and patterning using topographical and chemically modified surfaces, line edge roughness and dimensional control, x-ray scattering for characterization, and nanoscale driven assembly. Finally, Part 3 discusses application areas and related issues for DSA in nano-manufacturing, including for basic logic circuit design, the inverse DSA problem, design decomposition and the modelling and analysis of large scale, template self-assembly manufacturing techniques.…