contamination defects faults yield de khare jitendra (29 résultats)

Etat : Good. *Price HAS BEEN REDUCED by 10% until Monday, Oct. 13 (weekend SALE item)* 150 pp., Hardcover, ex library else text clean and binding tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.

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hardcover. Etat : New. In shrink wrap. Looks like an interesting title!

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Paperback. Etat : new. Paperback. Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing. From Contamination to Defects, Faults and Yield Loss: Simulation and Applications focuses on the core of the interface between manufacturing and testing, i.e., the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modeling and design manufacturing. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

Etat : New.

Etat : New.

Hardcover. Etat : new. Hardcover. Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies and better packing efficiency. However, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing.This volume focuses on the core of the interface between manufacturing and testing - the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate the probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modelling and design manufacturing. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

Etat : As New. Unread book in perfect condition.

Etat : New. In.

Etat : New. In.

Etat : Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.

Etat : New.

Etat : As New. Unread book in perfect condition.

Etat : New. pp. 172.

Etat : New. States that over the years there has been a large increase in the functionality available on a single integrated circuit. This book focuses on the core of the interface between manufacturing and testing, ie, the contamination-defect-fault relationship. Series: Frontiers in Electronic Testing. Num Pages: 166 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 930. . 1996. Hardback. . . . .

Paperback. Etat : Like New. Like New. book.

Etat : As New. Unread book in perfect condition.

Etat : New. States that over the years there has been a large increase in the functionality available on a single integrated circuit. This book focuses on the core of the interface between manufacturing and testing, ie, the contamination-defect-fault relationship. Series: Frontiers in Electronic Testing. Num Pages: 166 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 930. . 1996. Hardback. . . . . Books ship from the US and Ireland.

Paperback. Etat : new. Paperback. Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing. From Contamination to Defects, Faults and Yield Loss: Simulation and Applications focuses on the core of the interface between manufacturing and testing, i.e., the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modeling and design manufacturing. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

Hardcover. Etat : new. Hardcover. Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies and better packing efficiency. However, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing.This volume focuses on the core of the interface between manufacturing and testing - the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate the probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modelling and design manufacturing. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

Kluwer Academic Publishers, Boston, 1996. 150 pages, Paperback--- - former library book in good condition - 468 Gramm.

Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this gre.

Gebunden. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this gre.

Etat : New. Print on Demand pp. 172 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.

Hardback. Etat : New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 960.

Etat : New. PRINT ON DEMAND pp. 172.