Langue: anglais
Edité par Materials Research Society, 2001
ISBN 10 : 155899520X ISBN 13 : 9781558995208
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Ajouter au panierHardcover. Etat : Very Good. Hardcover Materials Research Society volume 612 in VG condition, with a single blemish: the upper corner of the front blank endpaper is clipped and missing. Slight pencil erasure inside the front cover, otherwise unmarked. [2.1 lbs]. Book.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
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Langue: anglais
Edité par Cambridge University Press 6/5/2014, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
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Ajouter au panierPaperback or Softback. Etat : New. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612. Book.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
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Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
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Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
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Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
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Langue: anglais
Edité par Cambridge University Press, 2014
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Ajouter au panierEtat : New. In.
Langue: anglais
Edité par Cambridge University Press 2014-05, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
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Langue: anglais
Edité par Cambridge University Press 2014-06-05, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
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Ajouter au panierPaperback. Etat : New.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
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Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
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Langue: anglais
Edité par Cambridge University Press, 2014
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Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
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Langue: anglais
Edité par Cambridge University Press CUP, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
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Ajouter au panierEtat : New. pp. 422.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
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Langue: anglais
Edité par Cambridge University Press, 2014
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Ajouter au panierEtat : New.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
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Ajouter au panierTaschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
EUR 49,97
Quantité disponible : 1 disponible(s)
Ajouter au panierTaschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Langue: anglais
Edité par Cambridge University Press, Cambridge, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
Vendeur : Grand Eagle Retail, Bensenville, IL, Etats-Unis
EUR 41,68
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Ajouter au panierPaperback. Etat : new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Langue: anglais
Edité par Cambridge University Press, Cambridge, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
Vendeur : Grand Eagle Retail, Bensenville, IL, Etats-Unis
EUR 46,12
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Ajouter au panierPaperback. Etat : new. Paperback. This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
Vendeur : Revaluation Books, Exeter, Royaume-Uni
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Ajouter au panierPaperback. Etat : Brand New. 1st edition. 614 pages. 9.02x5.98x1.22 inches. In Stock. This item is printed on demand.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
Vendeur : Revaluation Books, Exeter, Royaume-Uni
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Ajouter au panierPaperback. Etat : Brand New. 1st edition. 422 pages. 8.90x6.00x1.00 inches. In Stock. This item is printed on demand.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
Vendeur : THE SAINT BOOKSTORE, Southport, Royaume-Uni
EUR 41,12
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Ajouter au panierPaperback / softback. Etat : New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
Vendeur : Majestic Books, Hounslow, Royaume-Uni
EUR 54,28
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Ajouter au panierEtat : New. Print on Demand pp. 422.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
Vendeur : THE SAINT BOOKSTORE, Southport, Royaume-Uni
EUR 42,22
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Ajouter au panierPaperback / softback. Etat : New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Langue: anglais
Edité par Cambridge University Press, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
Vendeur : Biblios, Frankfurt am main, HESSE, Allemagne
EUR 54,97
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Ajouter au panierEtat : New. PRINT ON DEMAND pp. 422.
Langue: anglais
Edité par Cambridge University Press, Cambridge, 2014
ISBN 10 : 1107409225 ISBN 13 : 9781107409224
Vendeur : CitiRetail, Stevenage, Royaume-Uni
EUR 44,63
Quantité disponible : 1 disponible(s)
Ajouter au panierPaperback. Etat : new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Langue: anglais
Edité par Cambridge University Press, Cambridge, 2014
ISBN 10 : 110741315X ISBN 13 : 9781107413153
Vendeur : CitiRetail, Stevenage, Royaume-Uni
EUR 44,63
Quantité disponible : 1 disponible(s)
Ajouter au panierPaperback. Etat : new. Paperback. This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Langue: anglais
Edité par Cambridge University Press, 2013
ISBN 10 : 110741315X ISBN 13 : 9781107413153
Vendeur : moluna, Greven, Allemagne
EUR 42,05
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Ajouter au panierEtat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.KlappentextThe MRS Symposium Proceeding series is an internationally recognised reference suitable for research.